公开(公告)号：US11862440B2

公开(公告)日：2024-01-02

申请号：US17373214

申请日：2021-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongil Mun ,  Jinyoung Park ,  Jongwoo Sun ,  Hyungjoo Lee

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32715 ,  H01J37/32541 ,  H01J37/32568 ,  H01L21/6833 ,  H01J37/32697

Abstract: Semiconductor processing equipment and an electrostatic chuck include a semiconductor having: an upper electrode; a gas supplier connected to the upper electrode; and a substrate supporting structure spaced apart from the upper electrode to define a processing volume. The substrate supporting structure supports a substrate and includes: a lower electrode having a side area disposed outside a step formed at an outer perimeter portion of the lower electrode and a processing area disposed inside the step; a first plate disposed on the lower electrode; an attraction electrode disposed on the first plate; and a second plate disposed on the attraction plate. The second plate supports the substrate in a state in which the substrate is laid on an upper surface of the second plate. Each of the first plate and the second plate includes ceramic. The lower electrode has a maximum height at a central portion of the processing area.

公开(公告)号：US11715628B2

公开(公告)日：2023-08-01

申请号：US17184962

申请日：2021-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongil Mun ,  Kyeonghun Kim ,  Taekyoon Park ,  Jongwoo Sun ,  Seeyub Yang ,  Yongseok Lee ,  Hyungjoo Lee ,  Eunhee Jeang

IPC: H01J37/32 ,  H01J9/24

CPC classification number: H01J37/32467 ,  H01J9/245 ,  H01J37/32119 ,  H01J37/32238 ,  H01J37/32972 ,  H01J2237/103

Abstract: A method of forming a plasma processing apparatus comprises providing a chamber, the chamber including a wall defining an interior, and a viewport extending through the wall. An analysis apparatus connected to the viewport may be formed. The analysis apparatus includes an analyzer adjacent to the chamber, a probe connected to the analyzer and aligned with the viewport, and a first window aligned with the probe, the first window having a first surface, and a second surface at an opposite side relative to the first surface, the second surface being exposed to the interior of the chamber, and the second surface of the first window has a scattering surface.

公开(公告)号：US12009577B2

公开(公告)日：2024-06-11

申请号：US17955770

申请日：2022-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung Kwon ,  Sumin Yun ,  Hosaeng Kim ,  Hyunjeong Lee ,  Hyungjoo Lee

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q5/25 ,  H01Q5/307 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q5/25 ,  H01Q5/307 ,  H01Q9/0407

Abstract: An electronic device includes a housing providing a front surface and a rear surface, an antenna including a printed circuit board within the housing and including a first surface facing the front surface and a second surface facing the rear surface. The printed circuit board includes a first conductive layer including a first antenna element and a second antenna element that do not overlap each other when viewed from above the first surface, a second conductive layer operating as a ground plane, and a dielectric between the first and second conductive layers. A conductive pattern is located between the front surface and the second surface when the first surface faces the rear surface and is located between the rear surface and the second surface when the first surface faces the front surface. The conductive pattern overlaps a part of the second conductive layer when viewed from above the first surface.

公开(公告)号：US11264291B2

公开(公告)日：2022-03-01

申请号：US16822319

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seeyub Yang ,  Jeongil Mun ,  Hyungjoo Lee ,  Kyoungsuk Kim ,  Kyeonghun Kim ,  Jongwoo Sun

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67 ,  H01L21/311

Abstract: An etching apparatus includes a reaction chamber having an internal space, a fixing chuck disposed in the reaction chamber, an electrostatic chuck disposed on the fixing chuck and on which a wafer is placed, a focus ring surrounding the electrostatic chuck, and a sensor device configured to be transferred into or out of the reaction chamber and placed on the electrostatic chuck. The sensor device includes a body having a plate shape, and a sensor disposed on an upper surface of the body which senses whether the focus ring is worn.

公开(公告)号：US12100884B2

公开(公告)日：2024-09-24

申请号：US18161394

申请日：2023-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungkoo Park ,  Hyungjoo Lee ,  Shinho Yoon ,  Himchan Yun ,  Soonho Hwang ,  Jaebong Chun

IPC: H01Q1/22 ,  G06F1/16 ,  H01Q1/38 ,  H05K1/18

CPC classification number: H01Q1/2266 ,  G06F1/1616 ,  G06F1/1626 ,  H01Q1/38 ,  H05K1/181 ,  H05K2201/1031

Abstract: An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.

公开(公告)号：US11114744B2

公开(公告)日：2021-09-07

申请号：US16596108

申请日：2019-10-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungkoo Park ,  Hyungjoo Lee ,  Shinho Yoon ,  Himchan Yun ,  Soonho Hwang ,  Jaebong Chun

IPC: H01Q1/22 ,  G06F1/16 ,  H01Q1/38 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.

公开(公告)号：USD1063595S1

公开(公告)日：2025-02-25

申请号：US29894971

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Hyungjoo Lee ,  Hyeondong Song

公开(公告)号：USD1062662S1

公开(公告)日：2025-02-18

申请号：US29894919

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Hyungjoo Lee ,  Hyeondong Song

公开(公告)号：US12183996B2

公开(公告)日：2024-12-31

申请号：US18173337

申请日：2023-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Yun ,  Soonheung Kwon ,  Hosaeng Kim ,  Hyungjoo Lee

IPC: H01Q9/04 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a first conductive patch, a second conductive patch, a third conductive patch, and a wireless communication circuit. The first conductive patch includes a first edge facing the second conductive patch, a second edge perpendicularly meeting the first edge at a first corner, a third edge parallel to the first edge, and a fourth edge that is parallel to the second edge and perpendicularly meets the third edge at a second corner. The second conductive patch and the third conductive patch each have a shape identical to that of the first conductive patch. The wireless communication circuit feed power to a first point of the first edge, a second point of a fifth edge of the second conductive patch, and a third point of a sixth edge of the third conductive patch.

公开(公告)号：US11569561B2

公开(公告)日：2023-01-31

申请号：US17394909

申请日：2021-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungkoo Park ,  Hyungjoo Lee ,  Shinho Yoon ,  Himchan Yun ,  Soonho Hwang ,  Jaebong Chun

IPC: H01Q1/22 ,  G06F1/16 ,  H01Q1/38 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.