公开(公告)号：US20180322083A1

公开(公告)日：2018-11-08

申请号：US16034470

申请日：2018-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Youl KIM ,  Chih Jen LIM ,  Jinook SONG ,  Sungjae LEE ,  Hyun-ki KOO ,  Donghyeon HAM

IPC: G06F13/40 ,  G06T1/20 ,  G06F13/16

Abstract: A system-on-chip (SoC) to perform a deadlock control on a processor of the SoC, the SoC including the processor including a plurality of central processing unit (CPU) cores, a first bus connected to the processor, a graphic processing unit (GPU) connected to the first bus, a memory controller connected to the first bus, a second bus connected to the processor, an isolation cell including a logic circuit configured to retain a signal value input to the processor according to an isolation signal, and a deadlock controller connected to the first bus and the second bus. The deadlock controller is configured to isolate the processor, which is in a deadlock state, from the first bus by applying the isolation signal on the isolation cell, and to extract, via the second bus, state information of the isolated processor in the deadlock state.

公开(公告)号：US20140356563A1

公开(公告)日：2014-12-04

申请号：US14280900

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungmo YANG ,  Kiwoong KIM ,  Kwangsu SEO ,  Sungjae LEE ,  Yongwoo JEON ,  Wonhee CHOI ,  Byounguk YOON

IPC: H05K5/03 ,  B29C35/08 ,  B29C45/16

CPC classification number: G03F7/0002 ,  B29C35/0805 ,  B29C37/0053 ,  B29C43/021 ,  B29C43/18 ,  B29C45/1679 ,  B29C2035/0827 ,  B29C2037/0035 ,  B29C2037/0042 ,  G03F7/20 ,  H04M1/0283 ,  H05K5/03 ,  Y10T428/13 ,  Y10T428/1352

Abstract: A surface treatment method of an electronic device is provided. The surface treatment method includes processing a first pattern on a surface of a top mold and a second pattern on a surface of a bottom mold, coating a Ultra-Violet (UV) molding liquid on each of a front surface of a raw sheet material and the bottom mold facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold and the bottom mold, pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.

Abstract translation: 提供电子设备的表面处理方法。 表面处理方法包括在上模的表面上加工第一图案，在底模的表面上加工第二图案，在原纸片的前表面上涂覆超紫（UV）成型液， 底部模具面对原料片材的后表面，将原料片材定位在顶模和底模之间，将顶模和底模相互压合，固化UV成型液，并分离原料 从顶模和底模获得片材，并在原料片的前表面和后表面上形成印刷层。

公开(公告)号：US20170199835A1

公开(公告)日：2017-07-13

申请号：US14995179

申请日：2016-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Youl KIM ,  Chih Jen LIN ,  Jinook SONG ,  Sungjae LEE ,  Hyun-ki KOO ,  Donghyeon HAM

IPC: G06F13/40 ,  G06T1/20 ,  G06F13/16

CPC classification number: G06F13/4036 ,  G06F13/1605 ,  G06F2213/16 ,  G06F2213/36 ,  G06T1/20 ,  G06T2200/28

Abstract: A system-on-chip (SoC) to perform a deadlock control on a processor of the SoC includes a processor of the SoC including a plurality of central processing unit (CPU) cores, a first bus connected to the processor, a graphic processing unit (GPU) connected to the first bus, a memory controller connected to the first bus, a second bus connected to the processor, an isolation cell including a logic circuit configured to retain a signal value input to the processor according to an isolation signal, and a deadlock controller connected to the first bus and the second bus, the deadlock controller being configured to isolate the processor, which is in a deadlock state, from the first bus by applying the isolation signal on the isolation cell, and extract, via the second bus, state information of the isolated processor in the deadlock state.