Abstract:
A defect detection device includes: a memory configured to store a layout image indicating a circuit pattern and indicating a dummy pattern; and a controller comprising an artificial neural network configured to learn the layout image, the controller being configured to: determine, based on an inspection image obtained by photographing an area including a defect on a wafer, whether the defect is in a first area in which the circuit pattern is positioned or in a second area in which the dummy pattern is positioned, by using the artificial neural network, and determine a type of the defect based on whether the defect is positioned is in the first area or in the second area.
Abstract:
A method of detecting defects of a wafer including generating a composite wafer map comprising defect points by combining a plurality of wafer level maps generated by measuring the wafer according to the respective process operations; sorting the defect points according to defect clusters using positions of the defect points included in the composite wafer map; and detecting an initial process operation, from among the respective process operations, in which a defect occurred, using operation information, for each of the defect clusters.
Abstract:
A method for acquiring and maintaining Global Positioning System (GPS) synchronization is provided for use in the wireless communication system. The method includes receiving, by at least one Global Positioning System (GPS) receiver, GPS absolute time information and GPS information from at least one GPS satellite; transmitting, from the at least one GPS receiver, to a base station, reference time information generated based on the GPS absolute time information; and generating, by the base station, base station absolute time information based on the reference time information.