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公开(公告)号:US20190074179A1
公开(公告)日:2019-03-07
申请号:US16120728
申请日:2018-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-jin PARK , Bong-soo KIM , Jin-bum KIM , Yoo-sang HWANG
IPC: H01L21/02 , H01L29/786 , H01L29/66 , H01L29/24 , H01L29/423 , H01L29/78 , H01L29/06
Abstract: A method of fabricating a device including a two-dimensional (2D) material includes forming an amorphous transition metal oxide structure on a substrate and replacing the amorphous transition metal oxide structure by a transition metal dichalcogenide structure. The transition metal dichalcogenide structure includes atomic layers, that are substantially parallel to a surface of the transition metal dichalcogenide structure.
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公开(公告)号:US20190074380A1
公开(公告)日:2019-03-07
申请号:US16120705
申请日:2018-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-jin PARK , Jin-bum Kim , Bong-soo Kim , Kyu-pil Lee , Hyeong-sun Hong , Yoo-sang Hwang
IPC: H01L29/786 , H01L29/24 , H01L29/423 , H01L29/78 , H01L29/86 , H01L29/66 , H01L21/02 , H01L29/06
Abstract: A device includes a substrate, a first electrode on the substrate, an insulating pattern on the substrate, a second electrode on an upper end of the insulating pattern, a two-dimensional (2D) material layer on a side surface of the insulating pattern, a gate insulating layer covering the 2D material layer, and a gate electrode contacting the gate insulting layer. The insulating pattern extends from the first electrode in a direction substantially vertical to the substrate. The 2D material layer includes at least one atomic layer of a 2D material that is substantially parallel to the side surface of the insulating pattern.
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公开(公告)号:US20190074180A1
公开(公告)日:2019-03-07
申请号:US16120775
申请日:2018-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-jin PARK , Bong-soo Kim , Jin-bum Kim , Yoo-sang Hwang
IPC: H01L21/02 , H01L29/786 , H01L29/66 , H01L29/24 , H01L29/423 , H01L29/78 , H01L29/06
Abstract: A method of fabricating a device including a two-dimensional (2D) material includes forming a transition metal oxide pattern on a substrate and forming a transition metal dichalcogenide layer on a top surface and a side surface of a residual portion of the transition metal oxide pattern. The forming the transition metal dichalcogenide layer may include replacing a surface portion of the transition metal oxide pattern with the transition metal dichalcogenide layer. The transition metal dichalcogenide layer includes at least one atomic layer that is substantially parallel to a surface of the residual portion of the transition metal oxide pattern.
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