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1.发明授权Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same 有权包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法公开(公告)号：US08829667B2
公开(公告)日：2014-09-09
申请号：US13968731
申请日：2013-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Woo Park , Wang-Ju Lee , In-Sang Song
IPC: H01L23/552 , H01L23/31
CPC classification number: H01L23/552 , H01L23/3128 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06568 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.
Abstract translation: 电子设备包括主板，半导体封装，上导电EMI屏蔽构件和下导电EMI屏蔽构件。 主板包括第一接地垫。 半导体封装与主板间隔开并电连接到主板。 上导电EMI屏蔽构件覆盖半导体封装的顶表面和侧壁。 下导电EMI屏蔽构件围绕主板和半导体封装之间的空间，并且电连接到上导电EMI屏蔽构件和第一接地垫。
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2.发明申请ELECTRONIC DEVICES INCLUDING EMI SHIELD STRUCTURES FOR SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME 有权包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法公开(公告)号：US20140048913A1
公开(公告)日：2014-02-20
申请号：US13968731
申请日：2013-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Woo Park , Wang-Ju Lee , In-Sang Song
IPC: H01L23/552
CPC classification number: H01L23/552 , H01L23/3128 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06568 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.
Abstract translation: 电子设备包括主板，半导体封装，上导电EMI屏蔽构件和下导电EMI屏蔽构件。 主板包括第一接地垫。 半导体封装与主板间隔开并电连接到主板。 上导电EMI屏蔽构件覆盖半导体封装的顶表面和侧壁。 下导电EMI屏蔽构件围绕主板和半导体封装之间的空间，并且电连接到上导电EMI屏蔽构件和第一接地垫。
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