公开(公告)号：US20220262777A1

公开(公告)日：2022-08-18

申请号：US17511178

申请日：2021-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： DOOHWAN LEE ,  Wonkyoung CHOI ,  JEONGHO LEE

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip and a passive device which are laterally spaced apart from each other on the first substrate and are disposed face-up on the first substrate, a first molding part surrounding the first semiconductor chip and the passive device on the first substrate, a second semiconductor chip disposed on the first molding part and electrically connected to the first semiconductor chip and the passive device, a second molding part surrounding the second semiconductor chip on the first molding part, first through-electrodes vertically penetrating the first molding part, at least some of first through-electrodes electrically connect the first substrate to the second semiconductor chip, and external terminals provided under the first substrate.

公开(公告)号：US20240170408A1

公开(公告)日：2024-05-23

申请号：US18426995

申请日：2024-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inhyung SONG ,  Kyoung Lim SUK ,  Jaegwon JANG ,  Wonkyoung CHOI

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5384 ,  H01L23/3114 ,  H01L23/5386 ,  H01L24/14

Abstract: A semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mold layer, the second redistribution substrate including a first opening that exposes a top surface of the first mold layer, a sidewall of the second redistribution substrate that is exposed to the first opening having a stepwise structure.

公开(公告)号：US20220068818A1

公开(公告)日：2022-03-03

申请号：US17213506

申请日：2021-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inhyung SONG ,  Kyoung Lim SUK ,  Jaegwon JANG ,  Wonkyoung CHOI

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mold layer, the second redistribution substrate including a first opening that exposes a top surface of the first mold layer, a sidewall of the second redistribution substrate that is exposed to the first opening having a stepwise structure.