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公开(公告)号:US20240021615A1
公开(公告)日:2024-01-18
申请号:US18163573
申请日:2023-02-02
发明人: Yoonjeong KIM , Yeongmin JEON , Hyewon JANG
IPC分类号: H01L27/092 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/775 , H01L21/8238 , H01L29/66
CPC分类号: H01L27/092 , H01L29/0673 , H01L29/41733 , H01L29/42392 , H01L29/775 , H01L21/823807 , H01L21/823814 , H01L29/66545 , H01L29/66439
摘要: A semiconductor device having active regions including a first active region and a second active region parallel to each other and respectively extending on a substrate in a first horizontal direction, a field region defining the active regions, a first insulating structure extending in the first horizontal direction on the field region, a gate structure extending, in a second horizontal direction, to intersect the active regions and the first insulating structure, source/drain regions disposed on at least one side of the gate structure, the source/drain regions including first source/drain regions on the first active region and second source/drain regions on the second active region, and a common contact plug on a first side of the gate structure and connected to the first and second source/drain regions opposing each other. The first insulating structure includes a first portion overlapping the gate structure in a vertical direction.
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公开(公告)号:US20200343364A1
公开(公告)日:2020-10-29
申请号:US16572681
申请日:2019-09-17
发明人: Donghyun KIM , Inhyun SONG , Yeongmin JEON , Sejin PARK , Juyun PARK , Jonghoon BAEK , Taeyeon SHIN , Sooyeon JEONG
IPC分类号: H01L29/66 , H01L21/8234 , H01L27/088 , H01L29/78
摘要: A semiconductor device may include: a dummy gate structure including a first gate pattern in which dummy gate lines extending in one direction are connected to each other on a substrate, and a second gate pattern in which dummy gate lines extending in the one direction are connected to each other on the same line with the first gate pattern; and a third gate pattern extending in parallel with the dummy gate structure on one side of the dummy gate structure.
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