公开(公告)号：US20240055406A1

公开(公告)日：2024-02-15

申请号：US18364802

申请日：2023-08-03

申请人： Samsung Electronics Co., Ltd.

发明人： Yeongseon Kim ,  Dohyun Kim ,  Juhyeon Kim ,  Hyoeun Kim ,  Seonkyung Seo ,  Chajea Jo

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2224/0384 ,  H01L2224/039 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05541 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/08121 ,  H01L2224/08148 ,  H01L2224/08235 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/38

摘要： A semiconductor package includes a first semiconductor chip including a first semiconductor device, a second semiconductor chip including a second semiconductor device, and a bonding structure between the first and second semiconductor chips, the bonding structure including a first bonding pad, a first bonding insulating layer, a second bonding pad in contact with the first bonding pad, and a second bonding insulating layer in contact with the first bonding insulating layer. The first bonding pad may include a first pad metal layer and a first conductive barrier layer surrounding the first pad metal layer, and the first conductive barrier layer may include a horizontal extension portion extending on an edge of an upper surface of the first pad metal layer.