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公开(公告)号：US11935149B2
公开(公告)日：2024-03-19
申请号：US17544411
申请日：2021-12-07
发明人： Dohyun Kim , Igor Nazarov
CPC分类号： G06T1/20 , H04N7/0127 , G06T2200/28 , G09G2340/0435
摘要： An electronic device is provided. The electronic devices includes a display, a memory, and a processor configured to be operatively connected to the display and the memory. The processor is configured to generate a main thread related to a user input and data processing on an application in response to execution of the application and a render thread related to rendering image data in units of frames based on data processed in the main thread, configure a target frame rate for displaying an execution screen of the application on the display, calculate an expected processing time of a current frame based on a processing time of at least one previous frame output through the display, determine a time margin based on the target frame rate and the calculated expected processing time, and perform the user input and data processing after the main thread waits in a sleep state for the time margin.
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公开(公告)号：US11480175B2
公开(公告)日：2022-10-25
申请号：US16861673
申请日：2020-04-29
发明人： Junghoon Park , Sunghea Cho , Jongcheun Seo , Namkyu Cho , Dohyun Kim , Junguk Jun
摘要： A scroll compressor includes a main body, a cover to divide the main body into a low pressure section and a high pressure section, a fixed scroll including a first discharge port, an orbiting scroll to rotate with respect to the fixed scroll and to form a compression chamber together with the fixed scroll, a discharge guide disposed between the fixed scroll and the cover and including a second discharge port connected to the first discharge port, and a back pressure actuator configured to form a back pressure chamber together with the discharge guide and to move in a direction toward the cover with respect to the discharge guide to selectively connect the second discharge port with the high pressure section. The fixed scroll includes a bypass flow path connecting the compression chamber and the second discharge port and a bypass valve to open or close the bypass flow path.
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公开(公告)号：US12025126B2
公开(公告)日：2024-07-02
申请号：US17985372
申请日：2022-11-11
发明人： Sunghea Cho , Dohyun Kim , Jongcheun Seo
CPC分类号： F04C18/0215 , F01C17/066 , F04C23/008 , F04C2240/50
摘要： A scroll compressor including a fixed scroll including a fixed wrap, an orbiting scroll including an orbiting wrap facing the fixed scroll to form a compression chamber together with the fixed wrap, and a first receiving groove formed on a second surface, opposite to the orbiting wrap, a frame including a second receiving groove formed on a surface facing the second surface of the orbiting scroll and forming a ring-shaped chamber disposed inside the frame and between the second surface and the surface of the frame, a guide ring disposed in the ring-shaped chamber, and a plurality of roller bearings each including an inner ring fixed to the guide ring, wherein some of the roller bearings are disposed in the first receiving groove and others are disposed in the second receiving groove, and the guide ring and the plurality of roller bearings prevent the orbiting scroll from rotating.
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公开(公告)号：US11815090B2
公开(公告)日：2023-11-14
申请号：US17199267
申请日：2021-03-11
发明人： Sunghea Cho , Junghoon Park , Jongcheun Seo , Namkyu Cho , Dohyun Kim , Junguk Jun
CPC分类号： F04C15/0007 , F04C2/025 , F04C2240/30
摘要： Provided is a scroll compressor with enhanced sealing structure of a back pressure chamber. The scroll compressor includes a housing, a fixed scroll fixed to inside of the housing and including a fixed wrap, an orbit scroll including an orbit wrap which forms a compression chamber together with the fixed wrap, a back pressure chamber formed at a frame supporting the orbit scroll, and accommodating refrigerant for pressurizing the orbit scroll to a direction of the fixed scroll, and a sealing ring arranged between the fixed scroll and the orbit scroll to prevent the refrigerant in the back pressure chamber from flowing in or out through a gap between the fixed scroll and the orbit scroll, wherein the sealing ring includes a cut portion cut for the sealing ring to be deformable in a circumferential direction.
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公开(公告)号：US11668812B2
公开(公告)日：2023-06-06
申请号：US17007348
申请日：2020-08-31
发明人： Dohyun Kim
IPC分类号： G01S7/41 , G01S13/42 , G01S13/86 , G01S13/931 , G06V20/58 , G06F18/25 , G06V10/22 , G06V20/56
CPC分类号： G01S13/865 , G01S7/412 , G01S13/42 , G01S13/867 , G01S13/931 , G06F18/25 , G06V10/22 , G06V20/56 , G06V20/58
摘要： An object detection device includes a first sensor, a second sensor, a calculation range selector and an estimator. The first sensor outputs a radio frequency (RF) signal, receives a reflected RF signal reflected from an object, and obtains a first measurement value for the object based on a received reflected RF signal. The second sensor obtains a second measurement value for the object by sensing a physical characteristic from the object. The physical characteristic sensed by the second sensor is different from a characteristic of the object measured as the first measurement value obtained by the first sensor. The calculation range selector sets a first reference range based on the second measurement value. The first reference range represents a range of execution of a first calculation for detecting a position of the object using a first algorithm. The estimator performs the first calculation only on the first reference range using the first measurement value, and generates a first result value as a result of performing the first calculation. The first result value represents the position of the object.
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公开(公告)号：US11448213B2
公开(公告)日：2022-09-20
申请号：US16861673
申请日：2020-04-29
发明人： Junghoon Park , Sunghea Cho , Jongcheun Seo , Namkyu Cho , Dohyun Kim , Junguk Jun
摘要： A scroll compressor includes a main body, a cover to divide the main body into a low pressure section and a high pressure section, a fixed scroll including a first discharge port, an orbiting scroll to rotate with respect to the fixed scroll and to form a compression chamber together with the fixed scroll, a discharge guide disposed between the fixed scroll and the cover and including a second discharge port connected to the first discharge port, and a back pressure actuator configured to form a back pressure chamber together with the discharge guide and to move in a direction toward the cover with respect to the discharge guide to selectively connect the second discharge port with the high pressure section. The fixed scroll includes a bypass flow path connecting the compression chamber and the second discharge port and a bypass valve to open or close the bypass flow path.
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公开(公告)号：US20240170464A1
公开(公告)日：2024-05-23
申请号：US18356325
申请日：2023-07-21
发明人： Chajea Jo , Dohyun Kim , SeungRyong Oh
IPC分类号： H01L25/16 , H01L23/00 , H01L23/31 , H01L23/48 , H01L23/498
CPC分类号： H01L25/16 , H01L23/3135 , H01L23/481 , H01L23/49822 , H01L23/49838 , H01L23/49894 , H01L24/08 , H01L24/16 , H01L24/24 , H01L24/73 , H01L2224/08148 , H01L2224/16227 , H01L2224/16238 , H01L2224/24225 , H01L2224/73209 , H01L2924/15174
摘要： Disclosed is a semiconductor package including a substrate, a first semiconductor chip on the substrate and including a through via in the first semiconductor chip and a plurality of first bonding pads on an upper portion of the first semiconductor chip, a second semiconductor chip on the first semiconductor chip and including a plurality of second bonding pads on a lower portion of the second semiconductor chip, and a conductive post between a top surface of the substrate and a bottom surface of the second semiconductor chip and laterally spaced apart from the first semiconductor chip. The first bonding pads are in contact with the second bonding pads. A width in a first direction parallel to a plane defined by a bottom surface of the substrate of the second semiconductor chip is greater than a width in the first direction of the first semiconductor chip.
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公开(公告)号：US20240055406A1
公开(公告)日：2024-02-15
申请号：US18364802
申请日：2023-08-03
发明人： Yeongseon Kim , Dohyun Kim , Juhyeon Kim , Hyoeun Kim , Seonkyung Seo , Chajea Jo
IPC分类号： H01L25/065 , H01L25/10 , H01L23/31 , H01L23/00
CPC分类号： H01L25/0657 , H01L25/105 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L2225/06541 , H01L2225/06565 , H01L2224/0384 , H01L2224/039 , H01L2224/05014 , H01L2224/05015 , H01L2224/05541 , H01L2224/05554 , H01L2224/05555 , H01L2224/08121 , H01L2224/08148 , H01L2224/08235 , H01L2224/80203 , H01L2224/80895 , H01L2224/80896 , H01L2924/1431 , H01L2924/1434 , H01L2924/38
摘要： A semiconductor package includes a first semiconductor chip including a first semiconductor device, a second semiconductor chip including a second semiconductor device, and a bonding structure between the first and second semiconductor chips, the bonding structure including a first bonding pad, a first bonding insulating layer, a second bonding pad in contact with the first bonding pad, and a second bonding insulating layer in contact with the first bonding insulating layer. The first bonding pad may include a first pad metal layer and a first conductive barrier layer surrounding the first pad metal layer, and the first conductive barrier layer may include a horizontal extension portion extending on an edge of an upper surface of the first pad metal layer.
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公开(公告)号：US20240128236A1
公开(公告)日：2024-04-18
申请号：US18359031
申请日：2023-07-26
发明人： Hyoeun Kim , Dohyun Kim , Sunkyoung Seo
IPC分类号： H01L25/065 , H01L21/66 , H01L23/00
CPC分类号： H01L25/0657 , H01L22/32 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/80 , H01L2224/05073 , H01L2224/05124 , H01L2224/05147 , H01L2224/0603 , H01L2224/08059 , H01L2224/08145 , H01L2224/09055 , H01L2224/09515 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/80203 , H01L2224/80895 , H01L2224/80896 , H01L2225/06517 , H01L2225/06541 , H01L2924/37001
摘要： A semiconductor package includes a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip includes a first wiring layer on a first substrate, and a first passivation layer on the first wiring layer and that exposes at least portions of first bonding pads and a first test pad that are on the second wiring layer. The second semiconductor chip includes a second wiring layer on a second substrate and a second passivation layer on the second wiring layer and that exposes at least portions of third bonding pads and second test pad that are provided on the second wiring layer. The first bonding pads and respective ones of the third bonding pads are directly bonded to each other. The first passivation layer and the second passivation layer are directly bonded to each other.
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