公开(公告)号：US20230230955A1

公开(公告)日：2023-07-20

申请号：US17863568

申请日：2022-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeunhee HUH ,  Chisung BAE

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/481 ,  H01L25/50 ,  H01L2225/06541

Abstract: An integrated circuit having a plurality of stacked chips, and a method of manufacturing thereof are provided. The integrated circuit includes a substrate, a plurality of chips stacked on a printed circuit board, wherein each of the plurality of chips includes a plurality of circuits, and a plurality of interconnects configured to electrically connect each of the plurality of circuits included in the each of the plurality of chips to the substrate, wherein the plurality of chips are unconnected with regard to each other, and are stacked such that areas of each of the plurality of chips, to which the plurality of interconnects are connected, are disposed in a non-overlapping manner with each other.

公开(公告)号：US20250023465A1

公开(公告)日：2025-01-16

申请号：US18415335

申请日：2024-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeunhee HUH ,  Tae-Hwang KONG

IPC: H02M3/07

Abstract: There is provided a power converter including a first circuit, a second circuit and a controller. The first circuit includes a switched inductor circuit and outputs a current based on a first voltage as an input. The second circuit includes a switched capacitor circuit and an output capacitor and outputs a second voltage lower than the first voltage, based on the current output by the first circuit as an input. The controller controls the second circuit to output the second voltage.

公开(公告)号：US20210067063A1

公开(公告)日：2021-03-04

申请号：US16794709

申请日：2020-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeunhee HUH ,  Sang Joon KIM ,  Seungchul JUNG

IPC: H02N2/18 ,  H02J50/15 ,  H01L41/113 ,  H01L41/29 ,  H02J50/00 ,  H02M7/219 ,  H02J7/00 ,  H02J7/06

Abstract: A power providing device is provided. The power providing device includes a first energy harvester element configured to generate power in response to an external energy signal being received, a connection switching element configured to switch a connection between the first energy harvester element and a second energy harvester element; and a first rectifier comprising one or more path switching elements configured to change a rectification path in response to the switching of the connection switching element, wherein the first rectifier is connected to the first energy harvester element to rectify the power generated by the first energy harvester element along the rectification path.

公开(公告)号：US20250096786A1

公开(公告)日：2025-03-20

申请号：US18678867

申请日：2024-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehwang KONG ,  Yeunhee HUH

IPC: H03K17/0412 ,  H02M1/08 ,  H02M3/158 ,  H03K17/16

Abstract: Provided is an auxiliary circuit configured to estimate a Miller plateau of a power transistor in a power conversion system, the auxiliary circuit including a filtering circuit electrically connected to a switching node of the power conversion system and configured to filter a voltage of the switching node, and a sensing circuit electrically connected to an output node of the filtering circuit and configured to detect whether the voltage of the switching node reaches a predetermined voltage level based on a voltage of the output node of the filtering circuit.

公开(公告)号：US20240213220A1

公开(公告)日：2024-06-27

申请号：US18328848

申请日：2023-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeunhee HUH ,  Chisung BAE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/08 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2225/06548 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042

Abstract: An integrated circuit (IC) system including a first substrate comprising passive components, a first power managing IC chip including a first power managing IC stacked on the first substrate, first IC chip group including a IC stacked on top of the first power managing IC chip, a control IC chip, stacked on top of the first IC group, including a control IC configured to control the first IC and a second IC of a second IC chip group, the second IC chip group including the second IC stacked on top of the control IC chip, a second power managing IC chip including a second power managing IC stacked on top of the second IC chip group, and a second substrate comprising passive components stacked on top of the second power managing IC chip.

公开(公告)号：US20220115947A1

公开(公告)日：2022-04-14

申请号：US17340550

申请日：2021-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeunhee HUH

IPC: H02M3/06

Abstract: A voltage converter circuit includes a capacitor having a first end selectively connected to an input power source through a first input switch and a second end selectively connected to the input power source through a second input switch, and a single inductor configured to generate an output voltage in response to a voltage of a node between the single inductor and the first input switch, selectively connect the input power source through the first input switch at the node, and connect the first end of the capacitor at the node.