公开(公告)号：US20150155618A1

公开(公告)日：2015-06-04

申请号：US14618182

申请日：2015-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Jin EOM ,  Hoon PARK ,  Ho-Saeng KIM ,  Austin KIM ,  Yong-Jin KIM ,  Chi-Hyung AHN

IPC: H01Q1/24 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  H01Q5/25 ,  H01Q5/378 ,  H01Q5/40 ,  H01Q7/00 ,  H01Q9/42 ,  H01Q13/16

Abstract: An antenna device attains good antenna performance using at least one or more metal members installed in a portable terminal. The antenna device includes a main board equipped with a power supply part for supplying power, a slot part which is positioned in at least one or more metal members or is formed by a combination of the metal members, and a power supply antenna member for receiving power from the power supply part and which is electromagnetically coupled with the slot part.

Abstract translation: 使用安装在便携式终端中的至少一个或多个金属构件，天线装置获得良好的天线性能。 天线装置包括配备有用于供电的电源部分的主板，位于至少一个或多个金属部件中的槽部或者由金属部件的组合形成的槽部，以及用于接收的电源天线部件 来自电源部分的电力并且与电源部分电磁耦合。

公开(公告)号：US20160275995A1

公开(公告)日：2016-09-22

申请号：US15168961

申请日：2016-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung SONG ,  Kyoungsun KIM ,  Yong-Jin KIM ,  Jaejun LEE ,  Sangseok KANG ,  Jungjoon LEE

IPC: G11C5/04 ,  G06F13/40 ,  G06F13/42 ,  G06F13/10

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.