Abstract:
According to various embodiments, an electronic device comprises a communication circuit, a processor, and a memory electrically connected to the processor, wherein the memory, when executed, can store commands for allowing the processor to: receive, from a first external electronic device, a first synchronization signal including first identification information through the communication circuit; synchronize the electronic device with the first external electronic device on the basis of at least a part of the information included in the first synchronization signal; receive, from a second external electronic device, a second synchronization signal including second identification information through the communication circuit; and control, on the basis of the second identification information and the first identification information, whether synchronization with second external electronic device occurs. Additional various embodiments are possible.
Abstract:
A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.
Abstract:
Provided are an apparatus, a memory device, and a method for multi-phase clock training. The memory device includes a clock training circuit configured to receive a clock through a first signal pin, among a plurality of signal pins and connected to a first signal line connected to the first signal pin. The clock training circuit generates a multi-phase clock upon receiving the clock, and generates a three-dimensional (3-D) duty offset code (DOC) for the multi-phase clock by simultaneously phase-sweeping between three internal clock signals in a duty adjustment step in the multi-phase clock. The memory device corrects a duty error of the multi-phase clock using the 3-D DOC.
Abstract:
A memory module includes a signal tab and a power tab spaced apart from each other on a surface layer of a substrate, the signal tab and the power tab defining a module tab area, a reference plane layer below the surface layer, the reference plane layer being recessed below the signal tab and being non-recessed below the power tab, and an insulating layer between the surface layer and the reference plane layer.
Abstract:
Provided are a polymer including a first repeating unit represented by Formula 1 and having a glass transition temperature of 50° C. or less, a polymer-containing composition including the polymer, and a method of forming a pattern by using the polymer-containing composition: wherein, in Formula 1, descriptions of L11 to L13, a11 to a13, An, R11, R12, b12, and p1 are provided in the present specification.
Abstract:
Provided are a polymer including a first repeating unit represented by Formula 1 below, a resist composition including the same, a method of forming a pattern by using the same, and a monomer represented by Formula 10 below. In Formulae 1 and 10, L11 to L13, a11 to a13, X11, Rf, and R11 to R13 are as described in the specification.
Abstract:
An electronic device is provided. The electronic device includes a display, a communication circuit, a memory, and a processor. The processor is configured to receive first system information broadcast from a base station using the communication circuit, connect to a cell associated with the base station based on the first system information using the communication circuit, and trigger, based on a frequency band of the cell and radio resource information about the cell, a first event indicating that device-to-device communication is possible or a second event indicating that the device-to-device communication is impossible.
Abstract:
A motor of the invention includes a stator having a slot wound with a coil and a circular shaped housing accommodating the stator, and a rotor disposed on an inner surface of the housing and spaced apart from the slot and having a plurality of permanent magnets having the same number as magnetic poles and having different magnetic polarities. Each of the plurality of permanent magnets has a length corresponding to a first angle according to the number of magnetic poles. The plurality of permanent magnets are spaced apart from each other at a third angle according to the first angle and a second angle corresponding to the number of magnetic poles. The first, second, third angles of the motor refer to a center point of the housing as an angle reference point. The motor of an embodiment may be a motor provided in a washing machine.
Abstract:
A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.