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公开(公告)号：US20240136231A1
公开(公告)日：2024-04-25
申请号：US18139674
申请日：2023-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Donggap SHIN , Yongin LEE , Wooyoung KIM , Bumki MOON , Jiwon MOON , Seungdae SEOK , Siwoong WOO , Byeongtak PARK
CPC classification number: H01L22/12 , H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/08145 , H01L2224/74 , H01L2224/8001 , H01L2224/80894 , H01L2224/80908 , H01L2924/3511 , H01L2924/35121 , H01L2924/401
Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
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Patent Agency Ranking
公开(公告)号：US20180174871A1
公开(公告)日：2018-06-21
申请号：US15838713
申请日：2017-12-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joong-Ha LEE , Sang-Yoon KIM , YoungBum KIM , Hui-Jae KIM , SeungDae SEOK , Jaebong SHIN , Byungjoon LEE , Yongin LEE , Jaeyeon PYO
IPC: H01L21/67 , H01L21/683
CPC classification number: H01L21/67144 , H01L21/67092 , H01L21/67259 , H01L21/681 , H01L21/6838 , H01L27/148
Abstract: A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.
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公开(公告)号：US20220413722A1
公开(公告)日：2022-12-29
申请号：US17939393
申请日：2022-09-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongin LEE , Doogie Lee
Abstract: A storage device set is provided. The storage device set includes a reconfigurable logic chip and a storage device. The logic chip includes a retimer configured to generate an output signal by adjusting an input signal received from an external device; and an operation circuit configured to perform an operation function. The storage device includes: a first port connected to the retimer; a second port connected to the operation circuit; and a controller configured to control data transmission and reception via the first port and the second port.
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公开(公告)号：US20210173571A1
公开(公告)日：2021-06-10
申请号：US16941070
申请日：2020-07-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongin LEE , Doogie LEE
IPC: G06F3/06
Abstract: A storage device set is provided. The storage device set includes a reconfigurable logic chip and a storage device. The logic chip includes a retimer configured to generate an output signal by adjusting an input signal received from an external device; and an operation circuit configured to perform an operation function. The storage device includes: a first port connected to the retimer; a second port connected to the operation circuit; and a controller configured to control data transmission and reception via the first port and the second port.
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5.发明公开公开(公告)号：US20240242981A1
公开(公告)日：2024-07-18
申请号：US18415798
申请日：2024-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sehoon JANG , Inhwa BAEK , Hyungku KIM , Kibum YU , Jaesung YUN , Yongin LEE , Jaehyuk JUNG , Gwanghee JO , Youngjin CHO
CPC classification number: H01L21/67092 , H01L24/80 , H01L2224/80894
Abstract: A substrate bonding apparatus may include a first bonding chuck including a first base and a first transformation plate, and a second including a second base facing the first bonding chuck. The first base may include a recess groove. The recess groove may be recessed inward from a surface on which the first transformation plate is mounted. The first transformation plate may include a first protrusion protruding outward from a first surface of the first transformation plate. A second surface of the first transformation plate may be opposite the first surface of the first transformation plate. The second surface of the first transformation plate may be configured to support a first substrate. The first transformation plate may be mounted on the first base in a manner allowing a distance between the first transformation plate and the first base to vary.
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公开(公告)号：US20240234215A9
公开(公告)日：2024-07-11
申请号：US18139674
申请日：2023-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Donggap SHIN , Yongin LEE , Wooyoung KIM , Bumki MOON , Jiwon MOON , Seungdae SEOK , Siwoong WOO , Byeongtak PARK
CPC classification number: H01L22/12 , H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/08145 , H01L2224/74 , H01L2224/8001 , H01L2224/80894 , H01L2224/80908 , H01L2924/3511 , H01L2924/35121 , H01L2924/401
Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
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