公开(公告)号：US09698117B2

公开(公告)日：2017-07-04

申请号：US14600324

申请日：2015-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongdae Ha ,  Jaeryoung Lee ,  Chulmin Kim ,  Yisung Hwang ,  Teaseog Um ,  Yongjin Jung

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.