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公开(公告)号：US12229407B2
公开(公告)日：2025-02-18
申请号：US18356777
申请日：2023-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sooyong Suk , Chulmin Kim , Ohoon Kwon , Jaewon Kim , Jaeseon Sim , Yongtaek Lee , Hyunjoon Cha
Abstract: An electronic device is provided. The electronic device includes a volatile memory for storing user data, a non-volatile memory, and a processor operatively connected to the volatile memory and the non-volatile memory. The processor may be configured to store first compressed objects, which are obtained by compressing some of the user data in a page unit, in an empty area of the volatile memory, to move a second compressed object, which satisfies a specified condition, from among the first compressed objects to a temporary buffer set in the volatile memory, and to move third compressed objects, which are stored in the temporary buffer, to the non-volatile memory in a compressed state when the temporary buffer is filled to have a specified size or more.
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公开(公告)号：US09698117B2
公开(公告)日：2017-07-04
申请号：US14600324
申请日：2015-01-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongdae Ha , Jaeryoung Lee , Chulmin Kim , Yisung Hwang , Teaseog Um , Yongjin Jung
IPC: H01L23/00 , H01L21/683 , H01L21/67
CPC classification number: H01L24/75 , H01L21/67144 , H01L21/6838 , H01L2221/68363 , H01L2224/7555 , H01L2224/7565 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.
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Patent Agency Ranking
公开(公告)号：US20130256186A1
公开(公告)日：2013-10-03
申请号：US13783657
申请日：2013-03-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doojin Kim , Hyungjin Lee , Youngsik Kim , Sungbok Hong , Yongmin Kim , Chulmin Kim
IPC: H01L21/673
CPC classification number: H01L21/6735 , H01L21/6732
Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.
Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。
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公开(公告)号：US12032990B2
公开(公告)日：2024-07-09
申请号：US17432199
申请日：2020-02-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoon Cha , Chulmin Kim , Yongtaek Lee , Ohoon Kwon , Jaewon Kim , Sooyong Suk
Abstract: In certain embodiments, an electronic device comprises a display; a first memory; a second memory storing a plurality of applications; and a processor, wherein the processor is configured to: switch a screen displayed on the display from a first screen to a second screen, wherein the second screen includes a plurality of objects respectively indicating the plurality of applications; identify applications which are not running among the plurality of applications, in response to the switching to the second screen; and load data of at least one application from the second memory to the first memory, based on a predetermined criteria, before receiving an input selecting the at least one application.
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公开(公告)号：US11237741B2
公开(公告)日：2022-02-01
申请号：US16971580
申请日：2019-02-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyun Joon Cha , Chulmin Kim , Jaewon Kim , Taeho Kim , Sooyong Suk , Yongtaek Lee
IPC: G06F12/00 , G06F3/06 , G06F12/123
Abstract: An electronic device and a control method for controlling a memory are provided. An electronic device according to various embodiments of the present disclosure may comprise: a housing; a communication circuit; at least one processor operatively connected to the communication circuit; a non-volatile memory operatively connected to the processor and configured to store at least one file; and a volatile memory operatively connected to the processor, wherein the non-volatile memory stores instructions configured, when executed, to cause the processor to establish a first area and a second area on the volatile memory; store only first type data associated with the at least one file in the first area; store the first type data and/or store at least one second type data that is not associated with the at least one file, in the second area; receive a request for storing one of the at least one second type data, which exceeds a selected threshold value; and when the request is received, cause the first area to be in a state for storing the one of the at least one second type data, instead of the first type data.
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公开(公告)号：US10831392B2
公开(公告)日：2020-11-10
申请号：US16075447
申请日：2017-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chulmin Kim , Sunae Seo , Sooyong Suk
IPC: G06F3/06 , G06F12/126 , G06F12/0897 , G06F12/08 , G06F12/128 , G06F12/0868
Abstract: Various embodiments of the present invention relate to an apparatus and a method for managing memory in an electronic device. The electronic device comprises a volatile memory, a non-volatile memory and a processor, wherein the processor is configured to store first data and second data, stored in a first specified area of the volatile memory, in a second specified area of the volatile memory, to check the stored order of the first data and the second data stored in the second specified area, and to move at least one of the first data and the second data from the second specified area of the volatile memory to a third specified area of the non-volatile memory if the states of the first data and the second data satisfy a specified condition on the basis of the order. Other embodiments may be possible.
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公开(公告)号：US08905239B2
公开(公告)日：2014-12-09
申请号：US13783657
申请日：2013-03-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Doojin Kim , Hyungjin Lee , Youngsik Kim , Sungbok Hong , Yongmin Kim , Chulmin Kim
IPC: B65D85/00 , H01L21/673
CPC classification number: H01L21/6735 , H01L21/6732
Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.
Abstract translation: 例如，可以装载诸如半导体集成电路引线框架的条状部件的条形部件装载仓可以包括底板，设置在底板的相对侧的多个第一狭槽板，固定到顶部的顶板 所述第一狭槽板的一部分平行于所述底板，所述第二狭槽板设置成在所述第一狭槽板之间彼此面对并且能够移动;以及锁定单元，其将所述第二狭槽板紧固到至少所述顶板或底板 第二槽板平行于第一槽板固定。
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