公开(公告)号：US12125685B2

公开(公告)日：2024-10-22

申请号：US17975012

申请日：2022-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Soo Lee ,  Yoshihisa Hirano ,  Jae Hoon Kim ,  Young Jin Noh ,  Sung Moon Park ,  Seung Kyu Lim ,  Kyeong Seok Jeong ,  Hyung Kyu Choi

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/32091

Abstract: A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.

公开(公告)号：US20230047219A1

公开(公告)日：2023-02-16

申请号：US17975012

申请日：2022-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Soo Lee ,  Yoshihisa Hirano ,  Jae Hoon KIm ,  Young Jin Noh ,  Sung Moon Park ,  Seung Kyu Lim ,  Kyeong Seok Jeong ,  Hyung Kyu Choi

IPC: H01L21/3065 ,  H01J37/32

Abstract: A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.

公开(公告)号：US20200258753A1

公开(公告)日：2020-08-13

申请号：US16596945

申请日：2019-10-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Soo LEE ,  Yoshihisa Hirano ,  Jae Hoon Kim ,  Young Jin Noh ,  Sung Moon Park ,  Seung Kyu Lim ,  Kyeong Seok Jeong ,  Hyung Kyu Choi

IPC: H01L21/3065 ,  H01J37/32

Abstract: A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.