公开(公告)号：US09455294B2

公开(公告)日：2016-09-27

申请号：US14562923

申请日：2014-12-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-Ho Kim ,  Young-Hoon Park

IPC: H01L31/02 ,  H01L31/0216 ,  H01L27/146 ,  H01L31/0232

CPC classification number: H01L27/1464 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14683 ,  H01L31/02019 ,  H01L31/02327

Abstract: An image sensor includes a substrate having a front side and a back side, an insulating structure containing circuits on the front side of the substrate, contact holes extending through the substrate to the circuits, respectively, and a plurality of pads disposed on the backside of the substrate, electrically connected to the circuits along conductive paths extending through the contact holes, and located directly over the circuits, respectively. The image sensor is fabricated by a process in which a conductive layer is formed on the back side of the substrate and patterned to form the pads directly over the circuits.

公开(公告)号：US08933530B2

公开(公告)日：2015-01-13

申请号：US13672035

申请日：2012-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Ho Kim ,  Young-Hoon Park

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/1464 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14683 ,  H01L31/02019 ,  H01L31/02327

Abstract: An image sensor includes a substrate having a front side and a back side, an insulating structure containing circuits on the front side of the substrate, contact holes extending through the substrate to the circuits, respectively, and a plurality of pads disposed on the backside of the substrate, electrically connected to the circuits along conductive paths extending through the contact holes, and located directly over the circuits, respectively. The image sensor is fabricated by a process in which a conductive layer is formed on the back side of the substrate and patterned to form the pads directly over the circuits.

Abstract translation: 图像传感器包括具有前侧和后侧的基板，在基板的前侧包含电路的绝缘结构，分别穿过基板延伸到电路的接触孔和设置在基板的背面的多个焊盘 所述基板沿着延伸穿过所述接触孔的导电路径电连接到所述电路，并且分别直接位于所述电路之上。 图像传感器通过其中导电层形成在衬底的背面并被图案化以在电路上直接形成焊盘的工艺来制造。

公开(公告)号：US09111823B2

公开(公告)日：2015-08-18

申请号：US13757988

申请日：2013-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-Ho Kim ,  Duck-Hyung Lee ,  Young-Hoon Park

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14689

Abstract: An image sensor having a sensor array area, a circuit area around the sensor array area, and a pad area adjacent to the circuit area includes a substrate, a multi-layer wiring structure including a plurality of wiring layers on a first surface of the substrate in the circuit area, at least one well in the substrate in the circuit area, and metal wiring that extends on a second surface of the substrate opposite to the first surface, from the pad area to the circuit area, and extends from the second surface into contacts with the at least one well.

Abstract translation: 具有传感器阵列区域，传感器阵列区域周围的电路区域和与电路区域相邻的焊盘区域的图像传感器包括：衬底;在衬底的第一表面上包括多个布线层的多层布线结构 在所述电路区域中，所述电路区域中的所述基板中的至少一个阱以及在所述基板的与所述第一表面相反的第二表面上从所述焊盘区域延伸到所述电路区域的金属布线，并且从所述第二表面 与至少一个井接触。