公开(公告)号：US20140009416A1

公开(公告)日：2014-01-09

申请号：US13933438

申请日：2013-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Je-Hyun SON ,  Young-Jae KO ,  Min-Seok KIM ,  Sang-Ryul PARK ,  Ju-Gab LEE

IPC: G06F3/0354

CPC classification number: G06F3/03545 ,  G06F3/0416 ,  G06F3/046

Abstract: A method and apparatus for detecting by a digitizer an application of an electronic pen on or within a predetermined distance from a screen of an electronic device, and includes compensating coordinates of an electronic pen relative to screen. At least one magnetic field is detected that is produced by the electronic pen and that has a different central axis each other The digitizer determines whether the electronic pen is inclined based on a number of detected magnetic fields. A determination is made whether to apply a compensation value for compensating coordinates of the electronic pen based on determining inclination of the electronic pen. The present invention advantageously permits exact recognition of coordinates of the electronic pen whether then pen is inclined or not by performing the coordinate compensation taking into account the inclination of the electronic pen and the inclined direction.

Abstract translation: 一种用于由数字转换器检测电子笔在电子设备的屏幕上或距离电子设备的屏幕预定距离内的应用的方法和装置，并且包括补偿电子笔相对于屏幕的坐标。 检测由电子笔产生的并且具有彼此不同的中心轴的至少一个磁场。数字转换器基于检测到的磁场的数量确定电子笔是否倾斜。 确定是否基于确定电子笔的倾斜度来应用用于补偿电子笔的坐标的补偿值。 本发明有利地允许电子笔的坐标的精确识别，无论笔是否倾斜，通过考虑电子笔的倾斜度和倾斜方向执行坐标补偿。

公开(公告)号：US20160197031A1

公开(公告)日：2016-07-07

申请号：US14948774

申请日：2015-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hoon KIM ,  Young-Jae KO

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/12105 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/3436 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device including a semiconductor device and a method of mounting a semiconductor device are provided. The semiconductor device includes a base substrate having a semiconductor chip mounted on one surface thereof, a plurality of solder bumps arranged in a first region on another surface of the base substrate, at least one resin recess formed in a second region that is different from the first region on the other surface of the base substrate, and a bonding resin with which the at least one resin recess is filled, wherein the semiconductor device is mounted on a printed circuit board of an electronic device by a bonding resin. The semiconductor device and the electronic device including the same according to the present disclosure may be implemented in various ways according to embodiments.

Abstract translation: 提供了包括半导体器件的电子器件和安装半导体器件的方法。 所述半导体器件包括：基底基板，其具有安装在其一个表面上的半导体芯片;多个焊料凸块，布置在所述基底基板的另一个表面上的第一区域中;至少一个树脂凹部，形成在与 第一区域，以及填充有至少一个树脂凹部的接合树脂，其中半导体器件通过接合树脂安装在电子器件的印刷电路板上。 根据实施例，可以以各种方式实现根据本公开的包括其的半导体器件和电子器件。