公开(公告)号：US20170324909A1

公开(公告)日：2017-11-09

申请号：US15497576

申请日：2017-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hong-Suk CHOI ,  Jung-Hoon KIM ,  Ki-Huk LEE

IPC: H04N5/265 ,  G06T7/11 ,  H04N5/225

CPC classification number: H04N5/265 ,  G06T7/11 ,  G06T2207/10016 ,  H04N5/2256 ,  H04N5/2353 ,  H04N5/2354 ,  H04N5/2355

Abstract: An electronic device and a method for controlling the electronic device are provided. The electronic device includes a light emitter, an image sensor including a plurality of first pixels controlled based on a first parameter, and a plurality of second pixels controlled based on a second parameter, at least one sensor, and a processor. The processor is configured to detect a first object and a second object among a plurality of objects in an image area, determine the first parameter based on a first property of the first object and the second parameter based on a second property of the second object, said determination is based at least in part on a light intensity that is outputted from the light emitter, reflected by the first object and the second object, and detected by the image sensor or the at least one sensor, acquire a first image of the first object according to the first parameter using the plurality of first pixels and a second image of the second object according to the second parameter using the plurality of second pixels; and synthesize a first area corresponding to the first object in the first image with a second area corresponding to the second object in the second image to generate an output image.

公开(公告)号：US20200089618A1

公开(公告)日：2020-03-19

申请号：US16506308

申请日：2019-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hoon KIM ,  Young-Sik Lee

IPC: G06F12/1009

Abstract: A memory controller, an operating method of the memory controller, and a storage device including the memory controller are disclosed. The memory controller includes: a memory configured to store an address mapping table and a segment mapping table; and a mapping data management module configured to select at least two updated segments among a plurality of segments included in the address mapping table as page data to be stored in one page of a nonvolatile memory, wherein each of the plurality of segments includes a plurality of mapping entries representing mapping information between logical addresses and physical addresses, and wherein the segment mapping table includes physical addresses representing areas in which each of the plurality of segments is stored in the nonvolatile memory.

公开(公告)号：US20190188128A1

公开(公告)日：2019-06-20

申请号：US16106496

申请日：2018-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hoon KIM ,  Young-Sik LEE ,  Kang-Ho ROH

IPC: G06F12/02 ,  G06F3/06 ,  G06F12/0866

CPC classification number: G06F12/0246 ,  G06F3/0619 ,  G06F3/0655 ,  G06F3/0688 ,  G06F12/0292 ,  G06F12/0866

Abstract: To operate a nonvolatile memory system including a nonvolatile memory device and a memory controller, a mapping memory is divided into a plurality of mapping memory regions where the mapping memory stores mapping data representing a mapping relation between a logical address of a host device and a physical address of the nonvolatile memory device. Occupation information representing whether the mapping data are stored in each mapping memory region of the plurality of mapping memory regions are provided. Based on the occupation information, user data are stored in a corresponding mapping memory region of the plurality of mapping memory regions in which the mapping data are not stored.

公开(公告)号：US20170092818A1

公开(公告)日：2017-03-30

申请号：US15273993

申请日：2016-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Hoon KIM

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/14

Abstract: There is provided a light-emitting element mounting substrate which includes: an insulative base plate including a first surface and a second surface opposed to each other; a first conductive pad formed on the first surface of the insulative base plate; a second conductive pad formed on the first surface of the insulative base plate, and being separated from the first conductive pad; a first through hole and a second through hole penetrating through the insulative base plate and being separated from each other; a first through conduit filling the first through hole and being adjoined with the first conductive pad; and a second through conduit filling the second through hole and being adjoined with the second conductive pad, wherein, with reference to the first surface of the insulative base plate, a sum of an area of the first through conduit and an area of the second through conduit is between 20% and 80% of an area of the first surface of the insulative base plate.

公开(公告)号：US20160197031A1

公开(公告)日：2016-07-07

申请号：US14948774

申请日：2015-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hoon KIM ,  Young-Jae KO

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/12105 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/3436 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device including a semiconductor device and a method of mounting a semiconductor device are provided. The semiconductor device includes a base substrate having a semiconductor chip mounted on one surface thereof, a plurality of solder bumps arranged in a first region on another surface of the base substrate, at least one resin recess formed in a second region that is different from the first region on the other surface of the base substrate, and a bonding resin with which the at least one resin recess is filled, wherein the semiconductor device is mounted on a printed circuit board of an electronic device by a bonding resin. The semiconductor device and the electronic device including the same according to the present disclosure may be implemented in various ways according to embodiments.

Abstract translation: 提供了包括半导体器件的电子器件和安装半导体器件的方法。 所述半导体器件包括：基底基板，其具有安装在其一个表面上的半导体芯片;多个焊料凸块，布置在所述基底基板的另一个表面上的第一区域中;至少一个树脂凹部，形成在与 第一区域，以及填充有至少一个树脂凹部的接合树脂，其中半导体器件通过接合树脂安装在电子器件的印刷电路板上。 根据实施例，可以以各种方式实现根据本公开的包括其的半导体器件和电子器件。

公开(公告)号：US20150131242A1

公开(公告)日：2015-05-14

申请号：US14446289

申请日：2014-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Hoon KIM ,  Jin-Hyuk LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K5/00

CPC classification number: H05K1/0207 ,  H01L23/36 ,  H01L23/52 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10416 ,  H01L2924/00

Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.

Abstract translation: 本发明构思的实施例包括具有电路板的半导体器件，该电路板包括第一外层，第一外层中的接触区域，形成在第一外层的相对侧上的第二层，通孔和多个 的内层被形成为堆叠在第一层和第二层之间。 一个案例可以容纳电路板。 壳体可以具有突出部分，其被配置为在接触区域中与电路板接触。 多个内层可以包括接地层。 第一外层可以通过通孔连接到接地层。 壳体可以通过第一外层连接到接地层。