公开(公告)号：US20160111376A1

公开(公告)日：2016-04-21

申请号：US14874609

申请日：2015-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-rim SEO ,  Woon-bae KIM ,  Young-doo JUNG

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5225 ,  H01L23/60 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02372 ,  H01L2224/04105 ,  H01L2224/05025 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/80345 ,  H01L2224/96 ,  H01L2225/06537 ,  H01L2924/3025 ,  H05K1/0218 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.

Abstract translation: 一种半导体封装，包括具有活性表面和与该有源表面相对的非有效表面的半导体芯片，设置在半导体芯片的有源表面上的接地元件以及通过半导体芯片的电磁屏蔽元件，电连接到 可以提供接地部件，并且覆盖半导体芯片的非活性表面的至少一些区域。