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公开(公告)号：US11063174B2
公开(公告)日：2021-07-13
申请号：US16653449
申请日：2019-10-15
发明人： Doyoung Kwag , Masaru Wada , Jamyeong Koo , Eunhye Kim , Sangmoo Park , Seona Yang , Minsub Oh , Yoonsuk Lee , Youngkyong Jo
摘要： A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.
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公开(公告)号：US11417627B2
公开(公告)日：2022-08-16
申请号：US16992004
申请日：2020-08-12
发明人： Jamyeong Koo , Sungyong Min , Byunghoon Lee , Changjoon Lee , Changkyu Chung , Youngkyong Jo
IPC分类号： H01L23/00 , H01L25/16 , H01L25/075 , H01L25/00
摘要： A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.
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