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    MICRO LED DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    MICRO LED DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210005588A1

    公开(公告)日：2021-01-07

    申请号：US16901561

    申请日：2020-06-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Changkyu Chung ,  Kyungwoon Jang ,  Changjoon Lee

    IPC: H01L25/16 ,  H01L21/683 ,  H01L33/62 ,  H01L25/075

    Abstract: A method of manufacturing a micro light emitting diode (LED) display module includes stacking a connecting layer onto a transfer substrate on which a micro LED is disposed; positioning the transfer substrate above a display substrate, in which a plurality of thin-film transistors are formed, so that the micro LED faces the display substrate; transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method; and heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate by the connecting member.

    Micro LED display including antistatic ground circuit board
    5.
    发明授权
    Micro LED display including antistatic ground circuit board 有权

    公开(公告)号：US12119370B2

    公开(公告)日：2024-10-15

    申请号：US17535800

    申请日：2021-11-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seongho Son ,  Jongsung Lee ,  Changjoon Lee

    IPC: H01L27/02 ,  H01L27/15 ,  H05K9/00

    CPC classification number: H01L27/156 ,  H01L27/0248 ,  H05K9/0054 ,  H05K9/0067

    Abstract: An antistatic ground circuit board and a micro light emitting diode (LED) display including same are provided. The display includes a substrate comprising a first surface oriented toward a first direction, a second surface oriented toward a second direction opposite the first direction, and a side surface oriented toward a third direction perpendicular to the first and second directions, a first circuit unit disposed on the first surface, a second circuit unit disposed on the second surface, a side circuit unit disposed on the side surface and electrically connected to the first circuit unit, a plurality of micro LED chips arranged on one surface of the first circuit unit oriented toward the first direction, and a ground circuit board disposed on the second surface to ground static electricity generated in one or more circuit units from among the first circuit unit, the second circuit unit, and the side circuit unit.

    Display module having glass substrate formed with side wirings and method for manufacturing same
    10.
    发明授权
    Display module having glass substrate formed with side wirings and method for manufacturing same 有权

    公开(公告)号：US12218148B2

    公开(公告)日：2025-02-04

    申请号：US17512126

    申请日：2021-10-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeongyun Kim ,  Hosuk Kang ,  Jinwoo Jung ,  Changjoon Lee ,  Tackmo Lee ,  Gyun Heo ,  Soonmin Hong

    IPC: H01L27/12 ,  H01L25/16

    Abstract: Provided is a display module including a glass substrate, a thin film transistor (TFT) layer provided on a front surface of the glass substrate, a driving circuit provided on a rear surface of the glass substrate and configured to drive the TFT layer, a plurality of light emitting diodes (LED) electrically connected to the TFT layer, a plurality of first connection pads provided at intervals in a portion of the front surface of the glass substrate and electrically connected to a TFT circuit provided in in the TFT layer, a plurality of second connection pads provided at intervals in a portion of the rear surface of the glass substrate and electrically connected to the driving circuit, and a plurality of side wirings extending from the lateral surface of the glass substrate to a portion of an insulating layer and extending to another portion of the insulating layer.

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