公开(公告)号：US20210005588A1

公开(公告)日：2021-01-07

申请号：US16901561

申请日：2020-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changkyu Chung ,  Kyungwoon Jang ,  Changjoon Lee

IPC: H01L25/16 ,  H01L21/683 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing a micro light emitting diode (LED) display module includes stacking a connecting layer onto a transfer substrate on which a micro LED is disposed; positioning the transfer substrate above a display substrate, in which a plurality of thin-film transistors are formed, so that the micro LED faces the display substrate; transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method; and heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate by the connecting member.

公开(公告)号：US20210005796A1

公开(公告)日：2021-01-07

申请号：US16914863

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Min ,  Byunghoon Lee ,  Changjoon Lee ,  Kyungwoon Jang ,  Changkyu Chung

IPC: H01L33/56 ,  H01L33/00 ,  H01L27/15 ,  H01L33/62

Abstract: A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.

公开(公告)号：US12205977B2

公开(公告)日：2025-01-21

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck Hwang ,  Kyungwoon Jang ,  Changkyu Chung ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/15 ,  G09G3/32 ,  H01L33/00 ,  H01L25/16

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

公开(公告)号：US12033995B2

公开(公告)日：2024-07-09

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Gyun Heo ,  Tackmo Lee ,  Kyungwoon Jang ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L25/16 ,  G09G3/32 ,  H01L33/62

CPC classification number: H01L25/167 ,  G09G3/32 ,  H01L33/62 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2300/0452 ,  G09G2300/0842

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US20240274754A1

公开(公告)日：2024-08-15

申请号：US18621969

申请日：2024-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Kyungwoon Jang ,  Jinyoung Kim ,  Changkyu Chung

IPC: H01L33/38 ,  H01L25/16 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L25/167 ,  H01L33/42 ,  H01L2933/0016

Abstract: A display module is provided and includes a driving substrate; first electrodes on the driving substrate, and light-emitting diodes (LEDs) including: semi-conductor layers; second electrodes respectively corresponding to the first electrodes; protrusions on each of the second electrodes; and metal layers on the protrusions, each of the metal layers connected to one of the second electrodes. The display module further includes a non-conductive film layer between the driving substrate and the LEDs. The first electrodes and the second electrodes are connected by the metal layers.

公开(公告)号：US11189675B2

公开(公告)日：2021-11-30

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kyungwoon Jang ,  Gyun Heo ,  Youngjun Moon ,  Kwangrae Jo ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L27/32 ,  H01L27/15 ,  H05B33/10 ,  H05B45/20

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

公开(公告)号：US11417627B2

公开(公告)日：2022-08-16

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong Koo ,  Sungyong Min ,  Byunghoon Lee ,  Changjoon Lee ,  Changkyu Chung ,  Youngkyong Jo

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L25/00

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

公开(公告)号：US11362249B2

公开(公告)日：2022-06-14

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/58 ,  H01L33/48 ,  H01L33/00 ,  G09G3/32

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.