Abstract:
A probe card includes a first circuit substrate electrically connected to a tester, the first circuit substrate having a first size, a second circuit substrate on a lower surface of the first circuit substrate and electrically connected to the first circuit substrate, the second circuit substrate having a second size smaller than the first size, a probe head under the second circuit substrate and electrically connected to the second circuit substrate, the probe head including a plurality of probes in contact with terminals of a device under test (DUT), and a probe holder under the first circuit substrate and supporting the probe head.
Abstract:
A probe includes a beam and at least two tips. The beam transmits test signals to a device under test (DUT). The at least two tips are arranged on a first end portion of the beam in a direction at a predetermined angle to a length direction of the beam and contacts adjacent terminals of the DUT. The beam has a larger width that exceeds a sum of widths of the at least two tips in a width direction of the beam such that the probe has an improved current carrying capacity and is prevented from being damaged due to overcurrent.
Abstract:
A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card.