摘要:
A memory device includes a base die that includes a data signal bump configured to receive a data signal, a first memory stack that includes first memory dies sequentially stacked on the base die, and a second memory stack that includes second memory dies sequentially stacked on the base die and spaced from the first memory stack in a direction parallel to an upper surface of the base die. The base die is configured to selectively provide the data signal received through the data signal bump to one of the first memory stack or the second memory stack based on a selection signal.
摘要:
An input buffer includes a first buffer circuit to amplify a difference between a first input signal and a second input signal; a second buffer circuit formed of a replica circuit of the first buffer circuit to generate a common mode output signal in response to the first input signal; and a detector to compare the common mode output signal with a reference output signal and to control the first and second buffer circuits according to the comparison result such that a level of the common mode output signal coincides with a level of the reference output signal.
摘要:
A nonvolatile memory device includes a memory cell array comprising memory cells connected to bit lines and word lines; a word line decoder configured to apply word line voltages to the word lines; a bit line selector configured to select at least one bit line of the bit lines; a control logic configured to control the word line decoder and the bit line selector so that write data is programmed in the memory cell array; and a sudden power off (SPO) detection circuit, wherein the SPO detection circuit comprises: a sensing cell; a first driver configured to provide a first voltage to the sensing cell; and a second driver configured to provide a second voltage to the sensing cell, wherein a program state of the sensing cell becomes different depending on an order or a time difference between the first driver and the second driver being powered off.
摘要:
A memory device and a system includes a plurality of physical interfaces. The memory device includes a buffer die including a first interface circuit and a second interface circuit configured to communicate with an external device and a memory die stack mounted on the buffer die and including a plurality of stacked memory dies. The plurality of memory dies are electrically connected to the first interface circuit and the second interface circuit, the first interface circuit is configured to activate responsive to a first selection signal, and the second interface circuit is configured to activate responsive to a second selection signal. The first selection signal and the second selection signal are received from a memory controller external to the memory device.
摘要:
Disclosed is a memory device which includes a base die that includes a pair of second dies and a first die that is between the pair of second dies, and a memory stack that includes memory dies sequentially stacked on the base die in a vertical direction. The first die is electrically connected to the memory stack, and the first die includes a logic transistor including a channel of a three-dimensional structure.