公开(公告)号：US09580552B2

公开(公告)日：2017-02-28

申请号：US14685927

申请日：2015-04-14

Applicant: Samsung SDI Co., Ltd.

Inventor： Sang Kyun Im ,  Shin Hyo Bae ,  Su Yeong Son ,  Ki Yon Lee ,  So Young Kwon ,  Joon Sung Kim ,  Jin Kyu Kim ,  Tae Joon Park ,  Young Sub Jin

IPC: C08G63/02 ,  C08G69/44

CPC classification number: C08G69/44

Abstract: A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

Abstract translation: 聚酰胺酯树脂包括：衍生自二羧酸的重复单元; 衍生自二胺的重复单元; 和由式1表示的重复单元，其中聚酰胺酯树脂的熔融温度（Tm）为280℃以上。 通过施加环酯，聚酰胺酯树脂在耐吸湿性，耐热性，耐变色性，流动性等方面表现出优异的性能。 其中R 1为C 3〜C 12直链，支链或环状亚烷基。

公开(公告)号：US09902808B2

公开(公告)日：2018-02-27

申请号：US14583429

申请日：2014-12-26

Applicant: Samsung SDI Co., Ltd.

Inventor： So Young Kwon ,  Jin Kyu Kim ,  Young Sub Jin ,  Joon Sung Kim ,  Ki Yon Lee ,  Suk Min Jun

IPC: C08G69/26 ,  C08G69/30

CPC classification number: C08G69/265 ,  C08G69/30

Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

公开(公告)号：US09649617B2

公开(公告)日：2017-05-16

申请号：US14902076

申请日：2013-11-21

Applicant: Samsung SDI Co., Ltd.

Inventor： Sang Kyun Im ,  Ki Yon Lee ,  Shin Hyo Bae ,  Young Jun Kim ,  Kyoung Kyun Park ,  Young Sub Jin ,  Sang Hyun Jeon

IPC: B01J19/28 ,  C08G63/80 ,  C08G64/20 ,  C08G69/06 ,  C08G69/30 ,  B01J19/00 ,  C08G63/78

CPC classification number: B01J19/28 ,  B01J19/0073 ,  B01J2219/00094 ,  B01J2219/00159 ,  B01J2219/00162 ,  B01J2219/0204 ,  B01J2219/0245 ,  C08G63/785 ,  C08G63/80 ,  C08G64/205 ,  C08G69/06 ,  C08G69/30 ,  Y02P20/149

Abstract: A continuous solid-state polymerization device according to the present invention comprises: a feeder for injecting a prepolymer continuously; a transverse reactor connected to the feeder via a first connector to receive the prepolymer from the feeder and to perform solid-state polymerization, the reactor itself rotating; and a chamber connected to the transverse reactor via a second connector to receive a polymer, which has been discharged from the transverse reactor, and solid-state polymerization of which has been completed, and to discharge the polymer, wherein the transverse reactor has a demolding coating film formed on the inner wall thereof, and the feeder, the transverse reactor and the chamber are in a vacuum state. The continuous solid-state polymerization device can prevent formation of an interval, in which the prepolymer stagnates, and can perform solid-state polymerization continuously in a vacuum state without using inert gas.