Atomic Layer Deposition (ALD) Apparatus
    1.
    发明申请
    Atomic Layer Deposition (ALD) Apparatus 审中-公开
    原子层沉积(ALD)装置

    公开(公告)号:US20160122871A1

    公开(公告)日:2016-05-05

    申请号:US14743101

    申请日:2015-06-18

    摘要: An atomic layer deposition (ALD) apparatus includes a first process chamber in which a substrate is accommodated, a plasma generating unit provided on the outside of the first process chamber, a source gas supply unit provided on an upper portion of the plasma generating unit, and configured to supply a plurality of source gases, a purge gas supply unit configured to supply a purge gas to the first process chamber, and a gas control unit configured to control the supply of the source gases and the purge gas, wherein the plasma generating unit includes a second process chamber providing a space in which plasma is generated and a plasma antenna inducing a magnetic field in the second process chamber, and the source gases are supplied to the first process chamber through the plasma generating unit.

    摘要翻译: 原子层沉积(ALD)装置包括容纳基板的第一处理室,设置在第一处理室外侧的等离子体产生单元,设置在等离子体产生单元的上部的源气体供应单元, 并且被配置为提供多个源气体;净化气体供应单元,被配置为向第一处理室供应净化气体;气体控制单元,被配置为控制源气体和净化气体的供应,其中等离子体产生 单元包括提供产生等离子体的空间的第二处理室和在第二处理室中产生磁场的等离子体天线,并且源气体通过等离子体产生单元供应到第一处理室。