公开(公告)号：US20100308925A1

公开(公告)日：2010-12-09

申请号：US12456369

申请日：2009-06-16

申请人： Sang Sub Song ,  Kwang Seok Seo

发明人： Sang Sub Song ,  Kwang Seok Seo

IPC分类号： H03B7/12 ,  H01P7/06 ,  H01L21/50 ,  H01L21/311

CPC分类号： H01P11/008 ,  H01L2924/381 ,  H01P1/208 ,  H01P1/2088 ,  H01P11/002

摘要： A micromachined air-cavity resonator, a method for fabricating the micromachined air-cavity resonator, and a band-pass filter and an oscillator using the same are provided. In particular, a micromachined air-cavity resonator including a current probe fabricated together when the air-cavity resonator is fabricated, and a groove structure for rejecting detuning effect when an external circuit of a package substrate is coupled to the current probe, a millimeter-wave band-pass filter using the same, and a millimeter-wave oscillator using the same are provided. The micromachined air-cavity resonator includes a cavity structure which comprises a current probe simultaneously formed through a fabrication process, and a groove structure; and a package substrate integrated with the cavity structure. Thus, the micromachined air-cavity resonator can be easily fabricated by etching a silicon substrate and easily integrated to the package substrate using the flip-chip bonding.

摘要翻译： 提供微加工空腔谐振器，制造微加工空腔谐振器的方法，以及带通滤波器和使用其的振荡器。 特别地，包括当制造空腔谐振器时一起制造的电流探针的微加工空腔谐振器以及当封装衬底的外部电路耦合到电流探针时用于抑制失谐效应的凹槽结构， 使用其的波段带通滤波器和使用其的毫米波振荡器。 微加工空腔谐振器包括腔结构，其包括通过制造工艺同时形成的电流探针和凹槽结构; 以及与腔结构集成的封装衬底。 因此，可以通过蚀刻硅衬底并且使用倒装芯片接合容易地集成到封装衬底来容易地制造微加工空腔谐振器。

公开(公告)号：US20070138508A1

公开(公告)日：2007-06-21

申请号：US11565011

申请日：2006-11-30

申请人： Hyung Tae Kim ,  Kwang Seok Seo

发明人： Hyung Tae Kim ,  Kwang Seok Seo

IPC分类号： H01L29/739

CPC分类号： H03K3/315

摘要： A monostable to bistable transition logic element (MOBILE)-based delayed flip-flop circuit with a non-return-to-zero (NRZ)-mode output is constructed by including a parallel connection structure of a resonant-tunneling-diode (RTD) and a HEMT (High-Electron-Mobility-Transistor) used as a data input terminal and a series connection structure of the RTD and the HEMT used as a clock input terminal. The MOBILE-based delayed flip-flop circuit with a non-return-to-zero (NRZ)-mode output, includes a first high-electron-mobility-transistor for receiving a data signal as a control signal, a first resonant-tunneling-diode connected to the first high-electron-mobility-transistor in parallel, a second high-electron-mobility-transistor for receiving a clock signal as a control signal, wherein one side of the second high-electron-mobility-transistor is connected to one side of the first high-electron-mobility-transistor and a second resonant-tunneling-diode connected between the other side of the second high-electron-mobility-transistor and a ground side in series.

摘要翻译： 通过包括谐振隧穿二极管（RTD）的并联连接结构，构成了具有非归零（NRZ）模式输出的具有单稳态到双稳态转换逻辑元件（MOBILE）的延迟触发器电路， 以及用作数据输入端子的HEMT（高电子迁移率 - 晶体管）和用作时钟输入端子的RTD和HEMT的串联连接结构。 具有非归零（NRZ）模式输出的基于MOBILE的延迟触发器电路包括用于接收作为控制信号的数据信号的第一高电子迁移率晶体管，第一谐振隧穿 二极管并联连接到第一高电子迁移率晶体管，第二高电子迁移率晶体管，用于接收时钟信号作为控制信号，其中第二高电子迁移率晶体管的一侧被连接 连接在第一高电子迁移率晶体管的一侧和连接在第二高电子迁移率晶体管的另一侧和串联的接地侧之间的第二谐振隧道二极管。