公开(公告)号：US20240322417A1

公开(公告)日：2024-09-26

申请号：US18189684

申请日：2023-03-24

Applicant: QUALCOMM Incorporated

Inventor： Kai LIU ,  Jonghae KIM ,  Jui-Yi CHIU ,  Nosun PARK ,  Je-Hsiung LAN

IPC: H01P7/10 ,  H01P11/00 ,  H03B5/12

CPC classification number: H01P7/10 ,  H01P11/008 ,  H03B5/1206

Abstract: In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.

公开(公告)号：US20230420822A1

公开(公告)日：2023-12-28

申请号：US18212982

申请日：2023-06-22

Applicant: Nokia Solutions and Networks Oy

Inventor： Kimmo Kalervo Karhu

IPC: H01P7/10 ,  H01P11/00

CPC classification number: H01P7/10 ,  H01P11/008

Abstract: There is provided a dielectric resonator structure including at least a first resonator having a body including a first, a second and a third internal cavities, wherein the first cavity is arranged between the second and the third cavity, and the body further includes a first hole extending from the first cavity through the body, and a first opening arranged between the second and the third cavity.

公开(公告)号：US09954580B2

公开(公告)日：2018-04-24

申请号：US13560365

申请日：2012-07-27

Applicant: Kalaga Murali Krishna ,  Lohit Matani

Inventor： Kalaga Murali Krishna ,  Lohit Matani

IPC: H04B5/00 ,  C08K3/22 ,  H01P11/00

CPC classification number: H04B5/0037 ,  C08K3/22 ,  H01P11/008

Abstract: A power transfer system is provided. The power transfer system includes a field-focusing element including a dielectric material. The dielectric material includes a ceramic material and a polymer material. The ceramic material includes an oxide compound comprising titanium and the polymer material includes a resin.

公开(公告)号：US20180027644A1

公开(公告)日：2018-01-25

申请号：US15656509

申请日：2017-07-21

Applicant: Fermi Research Alliance, LLC

Inventor： Lance Cooley

IPC: H05H7/20 ,  H01P11/00 ,  H01P7/06 ,  H01L39/14 ,  H01L39/24

CPC classification number: H05H7/20 ,  H01L39/14 ,  H01L39/141 ,  H01L39/2406 ,  H01L39/2422 ,  H01L39/2487 ,  H01P7/06 ,  H01P11/008

Abstract: A system and method for fabricating accelerator cavities comprises forming at least two half cavities and joining the half cavities with a longitudinal seal. The half cavities can comprise at least one of aluminum, copper, tin, and copper alloys. The half cavities can be coated with a superconductor or combination of materials configured to form a superconductor coating.

公开(公告)号：US20170271744A1

公开(公告)日：2017-09-21

申请号：US15421640

申请日：2017-02-01

Applicant: Intel Corporation

Inventor： Ian Burke ,  Jason Cook ,  Ahmad Khanifar

IPC: H01P11/00 ,  C23C28/02 ,  C25D1/02 ,  C25D7/00 ,  C23C18/16 ,  H01P1/208

CPC classification number: H01P11/007 ,  C23C18/1653 ,  C23C18/1657 ,  C23C28/021 ,  C23C28/023 ,  C25D1/02 ,  C25D7/00 ,  H01P1/208 ,  H01P1/2138 ,  H01P11/008 ,  H01Q9/0407

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

公开(公告)号：US20170033427A1

公开(公告)日：2017-02-02

申请号：US15213071

申请日：2016-07-18

Applicant: European Space Agency

Inventor： Vittorio Tornielli di Crestvolant ,  Michael Lancaster ,  Petronilo Martin Iglesias

IPC: H01P5/12 ,  H01P7/06 ,  H01P11/00 ,  H01P1/207

CPC classification number: H01P5/12 ,  H01P1/207 ,  H01P5/181 ,  H01P5/227 ,  H01P7/06 ,  H01P11/002 ,  H01P11/007 ,  H01P11/008

Abstract: A multiport distribution network is provided that supports N inputs and N outputs, where N>1, the multipart distribution network providing an independent distribution path extending from each input to each output, each path being formed from a sequence of at least two fundamental units. Each fundamental unit comprises a circuit formed of multiple resonator cavities and having n input ports for receiving respective input signals, and n output ports for outputting respective output signals, where n>1, and wherein the circuit is configured to: (i) at each input port, split an input signal received at that input port into n equal signal components and provide each of the n signal components to a respective output port of the circuit; and (ii) at each output port, combine the signal components received from the n input ports to form an output signal for that output port. The multipart distribution network is configured to apply the same filter transfer function along each independent distribution path.

Abstract translation: 提供多端口分配网络，其支持N个输入和N个输出，其中N> 1，多分布分配网络提供从每个输入延伸到每个输出的独立分配路径，每个路径由至少两个基本单元的序列形成。 每个基本单元包括由多个谐振器腔形成并具有用于接收相应输入信号的n个输入端口的电路，以及用于输出相应输出信号的n个输出端口，其中n≥1，并且其中该电路被配置为：（i） 输入端口，将在该输入端口接收的输入信号分成n个相等的信号分量，并将n个信号分量中的每一个提供给电路的相应输出端口; 和（ii）在每个输出端口组合从n个输入端口接收的信号分量以形成该输出端口的输出信号。 多部分分配网络被配置为沿着每个独立分配路径应用相同的过滤器传递函数。

公开(公告)号：US08765621B2

公开(公告)日：2014-07-01

申请号：US13131119

申请日：2009-11-25

Applicant: Takafumi Kawano ,  Masataka Yamanaga ,  Atsushi Okabe

Inventor： Takafumi Kawano ,  Masataka Yamanaga ,  Atsushi Okabe

IPC: C04B35/20 ,  C04B35/465 ,  H01P7/10 ,  H01B3/12 ,  C04B35/457

CPC classification number: C04B35/465 ,  C04B35/20 ,  C04B35/457 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/3262 ,  C04B2235/3293 ,  C04B2235/3445 ,  C04B2235/3454 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5481 ,  C04B2235/608 ,  C04B2235/656 ,  C04B2235/77 ,  C04B2235/80 ,  C04B2235/963 ,  H01B3/12 ,  H01P7/10 ,  H01P11/008 ,  Y10T428/24355

Abstract: There is provided a dielectric ceramic composition for high-frequency use represented by a composition formula of a(Sn,Ti)O2-bMg2SiO4-cMgTi2O5-dMgSiO3. In the composition formula, a, b, c and d (provided that a, b, c and d are mol %) are within the following ranges: 4≦a≦37, 34≦b≦92, 2≦c≦15 and 2≦d≦15, respectively, and a+b+c+d=100. The dielectric ceramic composition for high-frequency use has a relative permittivity ∈r of 7.5-12.0, a Qm×fo value of not less than 50000 (GHz) and an absolute value of a temperature coefficient τf of resonance frequency fo of not more than 30 ppm/° C.

Abstract translation: 提供了由（Sn，Ti）O 2 -bMg 2 SiO 4 -cMgTi 2 O 5-dMgSiO 3的组成式表示的用于高频用途的电介质陶瓷组合物。 在组成式中，a，b，c和d（条件是a，b，c和d为摩尔％）在以下范围内：4＆nlE; a＆nlE; 37,34和nlE; b＆nlE; 92,2和nlE; c＆nlE; 15和 2＆nlE; d＆nlE; 15，a + b + c + d = 100。 用于高频率的电介质陶瓷组合物的相对介电常数εr为7.5-12.0，Qm×fo值不小于50000（GHz），谐振频率fo的温度系数τf绝对值不大于 30 ppm /°C

公开(公告)号：US08736403B2

公开(公告)日：2014-05-27

申请号：US12937049

申请日：2009-04-07

Applicant: Bernhard Schönlinner ,  William Gautier

Inventor： Bernhard Schönlinner ,  William Gautier

IPC: H01P1/208 ,  H01P7/06

CPC classification number: H01P1/2088 ,  H01P7/065 ,  H01P11/002 ,  H01P11/008

Abstract: The present disclosure provides example resonance filters and methods for making the same. The resonance filter includes a first layer having n adjacent resonance cavities, n being at least 2 and said cavities each being separated from one another by a partition wall. The resonance filter also includes a second layer having at least n−1 coupling cavities. The cavities in the first layer are formed as resonance cavities and those in the second layer are formed as (a) coupling cavity/cavities and are open on one side. The second layer is arranged on the first layer in such a way that the resonance cavities in the first layer are interconnected by the coupling cavity/cavities in the second layer. Further, the resonance filter is configured as a monolithic component.

Abstract translation: 本公开提供了示例性谐振滤波器及其制造方法。 谐振滤波器包括具有n个相邻谐振腔的第一层，n至少为2，并且所述空腔各自通过分隔壁彼此分离。 谐振滤波器还包括具有至少n-1个耦合腔的第二层。 第一层中的空腔形成为共振腔，第二层中的空腔形成为（a）耦合腔/空腔，并且在一侧开放。 第二层被布置在第一层上，使得第一层中的谐振腔通过第二层中的耦合空腔/空腔相互连接。 此外，谐振滤波器被配置为单片元件。

公开(公告)号：US20130076459A1

公开(公告)日：2013-03-28

申请号：US13247243

申请日：2011-09-28

Applicant: Stephen D. Berry ,  Stephen C. Holme ,  Slawomir J. Fiedziuszko

Inventor： Stephen D. Berry ,  Stephen C. Holme ,  Slawomir J. Fiedziuszko

IPC: H01P1/20

CPC classification number: H01P1/2084 ,  H01P1/2086 ,  H01P7/105 ,  H01P11/008

Abstract: A dual mode dielectric resonator (DR) filter has a first DR, and is configured to operate at a HE12ε mode within a first frequency band while exhibiting a Q factor of no less than 5000. A first characteristic size of the first DR may be substantially similar to a size of a second DR, where the second DR is configured to operate in a conventional DR filter at a HE11δ mode within a second frequency band, the second frequency band being substantially lower than the first frequency band.

Abstract translation: 双模介质谐振器（DR）滤波器具有第一DR，并且被配置为在HE12等离子体 模式在第一频带内，同时具有不小于5000的Q因子。第一DR的第一特征尺寸可以基本上类似于第二DR的大小，其中第二DR被配置为在常规DR滤波器中操作 在第二频带内的HE11δ模式下，第二频带基本上低于第一频带。

公开(公告)号：US20120313733A1

公开(公告)日：2012-12-13

申请号：US13158801

申请日：2011-06-13

Applicant: Timothy BERNHARDT ,  Jari TASKILA ,  Yunchi ZHANG

Inventor： Timothy BERNHARDT ,  Jari TASKILA ,  Yunchi ZHANG

IPC: H01P1/203

CPC classification number: H01P1/20345 ,  H01P1/203 ,  H01P1/2039 ,  H01P11/008 ,  H03H7/06

Abstract: Various exemplary embodiments relate to a support assembly for a planar filter. The assembly includes a u-shaped housing with angled surfaces at the inner corners of the u-shape, a first dielectric plate having a first angled surface in contact with one of the angled surfaces of the housing, a second dielectric plate having a second angled surface in contact with the other angled surface of the housing, at least one compressible ring, and a cover. The planar filter is supported between the first dielectric plate and the second dielectric plate. The cover compresses the compressible ring to apply downward force on the first and second dielectric plates. The downward force is translated to an inward force by the angled surfaces of the housing. The angled surfaces of the housing apply an inward force on the first dielectric plate and the second dielectric plate.

Abstract translation: 各种示例性实施例涉及用于平面过滤器的支撑组件。 组件包括在U形的内角处具有成角度表面的U形外壳，第一电介质板，其具有与壳体的一个倾斜表面接触的第一倾斜表面;第二电介质板，具有第二倾斜角 与壳体的另一个倾斜表面接触的表面，至少一个可压缩环和盖。 平面过滤器被支撑在第一电介质板和第二电介质板之间。 盖子压缩可压缩环以在第一和第二电介质板上施加向下的力。 向下的力通过壳体的倾斜表面转换成向内的力。 壳体的倾斜表面在第一电介质板和第二电介质板上施加向内的力。