Flip-chip bonding structure using multi chip module-deposited substrate
    1.
    发明申请
    Flip-chip bonding structure using multi chip module-deposited substrate 审中-公开
    使用多芯片模块沉积衬底的倒装键合结构

    公开(公告)号:US20070284728A1

    公开(公告)日:2007-12-13

    申请号:US11450064

    申请日:2006-06-09

    IPC分类号: H01L23/12 H01L21/44

    摘要: An MCM-D substrate in accordance with the present invention includes a silicon substrate provided with a Si-bump and a ground bump formed thereon, an insulating layer formed on the silicon substrate, a metal layer patterned on the insulating layer, a dielectric layer, a transmission line, a flip-chip bonding bump and a mounted component. The mount component is installed on a top of the Si-bump by a flip-chip bonding bump and the Si-bump prevents a dielectric layer from placing below the flip-chip bonding bump unlike a conventional technology. A ground bump makes an electric contact between a metal formed on a ground and a metal on the dielectric layer through a deep-via free process.

    摘要翻译: 根据本发明的MCM-D基板包括设置有Si凸块的硅衬底和形成在其上的接地凸块,在硅衬底上形成的绝缘层,在绝缘层上图案化的金属层,电介质层, 传输线,倒装芯片接合凸块和安装部件。 安装部件通过倒装芯片接合凸块安装在Si凸块的顶部上,并且Si凸块防止了电介质层放置在倒装芯片焊接凸起之下,这与传统技术不同。 接地突起通过深通孔过程在形成在地面上的金属和电介质层上的金属之间形成电接触。

    Method for displaying data for multitasking operation in mobile telecommunication terminal

    公开(公告)号:US07103387B2

    公开(公告)日:2006-09-05

    申请号:US10185141

    申请日:2002-06-27

    申请人: Kwang-Seok Seo

    发明人: Kwang-Seok Seo

    IPC分类号: H04B1/38 H04M1/00

    CPC分类号: H04M1/72522 H04M1/72547

    摘要: The present invention relates to a method for displaying data for multitasking operation in a mobile telecommunication terminal without deleting a task with a lower priority when a task with a higher priority simultaneously is operated. In other words, the inventive mobile telecommunication terminal is capable of converting a display assigned for each task while on multitasking operation. In order to implement the above function, a method for displaying data for multitasking operation in a mobile telecommunication terminal, comprising the steps of: while operating a first task, operating a second task responsive to a multitask request; determining whether a capacity of display conversion exceeds; if the capacity of display conversion exceeds, outputting an error message; and if the capacity of display conversion does not exceed, storing a display for displaying the first task and displaying the second task.

    APPARATUS AND METHOD FOR PROVIDING LOCATION-BASED DATA
    3.
    发明申请
    APPARATUS AND METHOD FOR PROVIDING LOCATION-BASED DATA 审中-公开
    用于提供基于位置的数据的装置和方法

    公开(公告)号:US20120202516A1

    公开(公告)日:2012-08-09

    申请号:US13195477

    申请日:2011-08-01

    IPC分类号: H04W64/00

    摘要: An apparatus capable of providing location-based data includes a communication unit to transmit data to a server and to receive base location-based data from the server via a communication network, a display unit to display the base location-based data, and a control unit to control the display unit to further display synthesized data including first user location-based data and the base location-based data. A method for providing location-based data includes acquiring user location-based data including location information, acquiring base location-based data including location information, and synthesizing the user location-based data into corresponding region of the base location-based data.

    摘要翻译: 能够提供基于位置的数据的装置包括通信单元,用于向服务器发送数据,并经由通信网络从服务器接收基于基于位置的数据;显示单元,用于显示基于基于位置的数据;以及控制 控制显示单元以进一步显示包括第一基于用户位置的数据和基于基于位置的数据的合成数据。 一种用于提供基于位置的数据的方法包括获取包括位置信息的基于用户位置的数据,获取包括位置信息的基于位置的数据,以及将基于用户位置的数据合成到基于基于位置的数据的对应区域中。

    Method of producing micromachined air-cavity resonator, micromachined
air-cavity resonator, band-pass filter and oscillator using the method
    4.
    发明申请
    Method of producing micromachined air-cavity resonator, micromachined air-cavity resonator, band-pass filter and oscillator using the method 审中-公开
    使用该方法制造微加工空腔谐振器,微加工空腔谐振器,带通滤波器和振荡器的方法

    公开(公告)号:US20100308925A1

    公开(公告)日:2010-12-09

    申请号:US12456369

    申请日:2009-06-16

    摘要: A micromachined air-cavity resonator, a method for fabricating the micromachined air-cavity resonator, and a band-pass filter and an oscillator using the same are provided. In particular, a micromachined air-cavity resonator including a current probe fabricated together when the air-cavity resonator is fabricated, and a groove structure for rejecting detuning effect when an external circuit of a package substrate is coupled to the current probe, a millimeter-wave band-pass filter using the same, and a millimeter-wave oscillator using the same are provided. The micromachined air-cavity resonator includes a cavity structure which comprises a current probe simultaneously formed through a fabrication process, and a groove structure; and a package substrate integrated with the cavity structure. Thus, the micromachined air-cavity resonator can be easily fabricated by etching a silicon substrate and easily integrated to the package substrate using the flip-chip bonding.

    摘要翻译: 提供微加工空腔谐振器,制造微加工空腔谐振器的方法,以及带通滤波器和使用其的振荡器。 特别地,包括当制造空腔谐振器时一起制造的电流探针的微加工空腔谐振器以及当封装衬底的外部电路耦合到电流探针时用于抑制失谐效应的凹槽结构, 使用其的波段带通滤波器和使用其的毫米波振荡器。 微加工空腔谐振器包括腔结构,其包括通过制造工艺同时形成的电流探针和凹槽结构; 以及与腔结构集成的封装衬底。 因此,可以通过蚀刻硅衬底并且使用倒装芯片接合容易地集成到封装衬底来容易地制造微加工空腔谐振器。

    Method and system for monitoring broadcast slot of mobile station
    5.
    发明授权
    Method and system for monitoring broadcast slot of mobile station 有权
    移动台广播时隙监控方法及系统

    公开(公告)号:US07532603B2

    公开(公告)日:2009-05-12

    申请号:US11167316

    申请日:2005-06-28

    申请人: Kwang-Seok Seo

    发明人: Kwang-Seok Seo

    IPC分类号: H04Q7/00

    摘要: Disclosed is a method and system for monitoring a broadcast slot of a mobile station. The system includes a mobile station execution module, wherein the mobile station execution module comprises: a broadcast channel setup information storage unit for storing broadcast channel setup information including at least one channel identification information and a broadcast time of each broadcast channel; and a broadcast slot monitoring controller for turning broadcast slot monitoring on during a predetermined time corresponding to the broadcast time of each broadcast channel contained in the broadcast channel setup information, and turning broadcast slot monitoring off during non-broadcast times.

    摘要翻译: 公开了一种用于监视移动台的广播时隙的方法和系统。 该系统包括移动台执行模块,其中移动台执行模块包括:广播频道建立信息存储单元,用于存储包括每个广播频道的至少一个频道标识信息和广播时间的广播频道设置信息; 以及广播时隙监视控制器,用于在对应于包含在广播频道设置信息中的每个广播频道的广播时间的预定时间内转播广播时隙监视,并且在非广播时间期间关闭广播时隙监视。

    Literal Gate Using Resonant Tunneling Diodes
    6.
    发明申请
    Literal Gate Using Resonant Tunneling Diodes 审中-公开
    文字门使用谐振隧道二极管

    公开(公告)号:US20090009218A1

    公开(公告)日:2009-01-08

    申请号:US12136250

    申请日:2008-06-10

    IPC分类号: H03K19/10 H03K17/58

    CPC分类号: H01L27/0788 H01L29/882

    摘要: The present invention relates to a literal gate using resonant tunneling diodes; and, more particularly, to a literal gate using only resonant tunneling diodes (RTDs).The present invention has an advantage in that it can provide a literal gate using resonant tunneling diodes, using fewer elements than a convention literal gate, utmost utilizing the input-output characteristics of an RTD, and reducing fabricating costs and improving a yield.

    摘要翻译: 本发明涉及使用谐振隧道二极管的文字门; 更具体地说,涉及仅使用谐振隧道二极管(RTD)的文字门。 本发明的优点在于,它可以使用谐振隧道二极管提供文字门,其使用比常规文字门更少的元件,最大限度地利用RTD的输入 - 输出特性,并降低制造成本并提高产量。

    Flip-chip bonding structure using multi chip module-deposited substrate
    7.
    发明申请
    Flip-chip bonding structure using multi chip module-deposited substrate 有权
    使用多芯片模块沉积衬底的倒装键合结构

    公开(公告)号:US20070001314A1

    公开(公告)日:2007-01-04

    申请号:US11302635

    申请日:2005-12-14

    IPC分类号: H01L23/48

    摘要: Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer.

    摘要翻译: 公开了使用MCM-D衬底的倒装片结合结构。 使用MCM-D衬底的倒装芯片接合结构包括:硅衬底,设置在硅衬底的预定位置处的Si凸块,其中Si凸块的材料与硅衬底相同,电介质 层,以及形成在Si凸起上的传输线,以连接到形成在电介质层上的电路。

    APPARATUS AND METHOD FOR SETTING A USER-DEFINED PATTERN FOR AN APPLICATION
    8.
    发明申请
    APPARATUS AND METHOD FOR SETTING A USER-DEFINED PATTERN FOR AN APPLICATION 审中-公开
    用于设置用户定义的应用模式的装置和方法

    公开(公告)号:US20130067497A1

    公开(公告)日:2013-03-14

    申请号:US13523249

    申请日:2012-06-14

    IPC分类号: G06F9/46

    摘要: In an apparatus to set a user-defined pattern for use in executing an application, the apparatus sets pattern information that indicates at least one of an input value according to a user input signal and an input value according to an input method for sensing information, and extracts task information of an application. Then, the apparatus generates mapping information based on the pattern information and the task information such that an application task corresponding to pattern information that is input in response to a user input signal is executed. A method for setting a reference pattern, including: receiving a first input; setting the reference pattern based on the first input; and mapping the reference pattern to an event of an application, wherein the event is executed in response to a duplication of the reference pattern.

    摘要翻译: 在设置用于执行应用程序的用户定义模式的装置中,根据用于感测信息的输入方法,根据用户输入信号和输入值来设置指示输入值中的至少一个的模式信息, 并提取应用程序的任务信息。 然后,该装置基于模式信息和任务信息生成映射信息,使得执行与响应于用户输入信号输入的模式信息相对应的应用任务。 一种用于设置参考图案的方法,包括:接收第一输入; 基于第一输入设置参考模式; 以及将所述参考模式映射到应用的事件,其中响应于所述参考模式的复制来执行所述事件。

    Flip-chip bonding structure using multi chip module-deposited substrate
    9.
    发明授权
    Flip-chip bonding structure using multi chip module-deposited substrate 有权
    使用多芯片模块沉积衬底的倒装键合结构

    公开(公告)号:US07375428B2

    公开(公告)日:2008-05-20

    申请号:US11302635

    申请日:2005-12-14

    IPC分类号: H01L23/48 H01L23/52 H01L29/40

    摘要: Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer.

    摘要翻译: 公开了使用MCM-D衬底的倒装片结合结构。 使用MCM-D衬底的倒装芯片接合结构包括:硅衬底,设置在硅衬底的预定位置处的Si凸块,其中Si凸块的材料与硅衬底相同,电介质 层,以及形成在Si凸起上的传输线,以连接到形成在电介质层上的电路。

    Mobile-Based Delayed Flip-Flop Circuit with NRZ-Mode Output
    10.
    发明申请
    Mobile-Based Delayed Flip-Flop Circuit with NRZ-Mode Output 审中-公开
    基于移动的延迟触发电路,具有NRZ模式输出

    公开(公告)号:US20070138508A1

    公开(公告)日:2007-06-21

    申请号:US11565011

    申请日:2006-11-30

    IPC分类号: H01L29/739

    CPC分类号: H03K3/315

    摘要: A monostable to bistable transition logic element (MOBILE)-based delayed flip-flop circuit with a non-return-to-zero (NRZ)-mode output is constructed by including a parallel connection structure of a resonant-tunneling-diode (RTD) and a HEMT (High-Electron-Mobility-Transistor) used as a data input terminal and a series connection structure of the RTD and the HEMT used as a clock input terminal. The MOBILE-based delayed flip-flop circuit with a non-return-to-zero (NRZ)-mode output, includes a first high-electron-mobility-transistor for receiving a data signal as a control signal, a first resonant-tunneling-diode connected to the first high-electron-mobility-transistor in parallel, a second high-electron-mobility-transistor for receiving a clock signal as a control signal, wherein one side of the second high-electron-mobility-transistor is connected to one side of the first high-electron-mobility-transistor and a second resonant-tunneling-diode connected between the other side of the second high-electron-mobility-transistor and a ground side in series.

    摘要翻译: 通过包括谐振隧穿二极管(RTD)的并联连接结构,构成了具有非归零(NRZ)模式输出的具有单稳态到双稳态转换逻辑元件(MOBILE)的延迟触发器电路, 以及用作数据输入端子的HEMT(高电子迁移率 - 晶体管)和用作时钟输入端子的RTD和HEMT的串联连接结构。 具有非归零(NRZ)模式输出的基于MOBILE的延迟触发器电路包括用于接收作为控制信号的数据信号的第一高电子迁移率晶体管,第一谐振隧穿 二极管并联连接到第一高电子迁移率晶体管,第二高电子迁移率晶体管,用于接收时钟信号作为控制信号,其中第二高电子迁移率晶体管的一侧被连接 连接在第一高电子迁移率晶体管的一侧和连接在第二高电子迁移率晶体管的另一侧和串联的接地侧之间的第二谐振隧道二极管。