公开(公告)号：US20130005088A1

公开(公告)日：2013-01-03

申请号：US13531983

申请日：2012-06-25

申请人： Sang-Uk HAN ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

发明人： Sang-Uk HAN ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

IPC分类号： H01L21/78

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81001 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

摘要翻译： 提供了形成半导体模块的方法。 该方法包括在支撑基板上形成具有粘合性的高分子材料层，使用高分子材料层将半导体芯片粘附到支撑基板上，将附着在支撑基板上的半导体芯片接合到柔性面板上， 支撑基板。

公开(公告)号：US08940621B2

公开(公告)日：2015-01-27

申请号：US13531983

申请日：2012-06-25

申请人： Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

发明人： Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81001 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

摘要翻译： 提供了形成半导体模块的方法。 该方法包括在支撑基板上形成具有粘合性的高分子材料层，使用高分子材料层将半导体芯片粘合到支撑基板上，将附着在支撑基板上的半导体芯片接合到柔性面板上， 支撑基板。

公开(公告)号：US09818732B2

公开(公告)日：2017-11-14

申请号：US14867806

申请日：2015-09-28

申请人： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

发明人： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L51/52 ,  H01L27/32

CPC分类号： H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

公开(公告)号：US20160020196A1

公开(公告)日：2016-01-21

申请号：US14867806

申请日：2015-09-28

申请人： Jae-Min JUNG ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

发明人： Jae-Min JUNG ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L51/52 ,  H01L27/32

CPC分类号： H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.