公开(公告)号：US20130005088A1

公开(公告)日：2013-01-03

申请号：US13531983

申请日：2012-06-25

申请人： Sang-Uk HAN ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

发明人： Sang-Uk HAN ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

IPC分类号： H01L21/78

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81001 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

摘要翻译： 提供了形成半导体模块的方法。 该方法包括在支撑基板上形成具有粘合性的高分子材料层，使用高分子材料层将半导体芯片粘附到支撑基板上，将附着在支撑基板上的半导体芯片接合到柔性面板上， 支撑基板。

公开(公告)号：US08940621B2

公开(公告)日：2015-01-27

申请号：US13531983

申请日：2012-06-25

申请人： Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

发明人： Sang-Uk Han ,  Jeong-Kyu Ha ,  Youngshin Kwon ,  Seung Hwan Kim ,  KwanJai Lee

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81001 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.

摘要翻译： 提供了形成半导体模块的方法。 该方法包括在支撑基板上形成具有粘合性的高分子材料层，使用高分子材料层将半导体芯片粘合到支撑基板上，将附着在支撑基板上的半导体芯片接合到柔性面板上， 支撑基板。

公开(公告)号：US09818732B2

公开(公告)日：2017-11-14

申请号：US14867806

申请日：2015-09-28

申请人： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

发明人： Jae-Min Jung ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L51/52 ,  H01L27/32

CPC分类号： H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

公开(公告)号：US20160020196A1

公开(公告)日：2016-01-21

申请号：US14867806

申请日：2015-09-28

申请人： Jae-Min JUNG ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

发明人： Jae-Min JUNG ,  Sang-Uk Han ,  KwanJai Lee ,  KyongSoon Cho ,  Jeong-Kyu Ha

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L51/52 ,  H01L27/32

CPC分类号： H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

公开(公告)号：US20120021600A1

公开(公告)日：2012-01-26

申请号：US13184810

申请日：2011-07-18

申请人： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

发明人： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

IPC分类号： H01L21/283

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of fabricating a film circuit substrate and a method of fabricating a chip package. The method of fabricating a film circuit substrate can include providing a base film including a chip packaging area to package a chip and a separation area to separate the two chip packaging areas from each other, the separation area including a cut area and an uncut area; forming a reserve interconnection pattern having a first height on the base film; and forming an interconnection pattern having a second height that is lower than the first height on the out area by selectively etching the reserve interconnection pattern of the cut area.

摘要翻译： 薄膜电路基板的制造方法以及芯片封装的制造方法。 制造薄膜电路基板的方法可以包括提供包括芯片封装区域以包装芯片的基膜和分离区域，以将两个芯片封装区域彼此分离，分离区域包括切割区域和未切割区域; 在基膜上形成具有第一高度的保留互连图案; 以及通过选择性地蚀刻所述切割区域的预留互连图案，形成具有低于所述外部区域上的所述第一高度的第二高度的互连图案。

公开(公告)号：US20130148312A1

公开(公告)日：2013-06-13

申请号：US13604412

申请日：2012-09-05

申请人： Sang-Uk Han ,  Young-Shin Kwon ,  Kwan-Jai Lee ,  Jae-Min Jung ,  Kyong-Soon Cho ,  Jeong-Kyu Ha

发明人： Sang-Uk Han ,  Young-Shin Kwon ,  Kwan-Jai Lee ,  Jae-Min Jung ,  Kyong-Soon Cho ,  Jeong-Kyu Ha

IPC分类号： H05K7/00

CPC分类号： H05K7/00 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10128

摘要： A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.

摘要翻译： 带状布线基板包括在基膜的第一表面中具有至少一个凹部的基膜和在基膜的第二表面上包含半导体芯片的芯片安装区域。 在基膜的第二表面上形成布线图案并延伸到芯片安装区域的边缘。 保护膜覆盖布线图案。

公开(公告)号：US09929083B2

公开(公告)日：2018-03-27

申请号：US15004176

申请日：2016-01-22

申请人： Jeong-Kyu Ha

发明人： Jeong-Kyu Ha

IPC分类号： H01L23/13 ,  H01L23/498

CPC分类号： H01L23/4985 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package includes a flexible film substrate including a chip mounting region and a cut-line interposed between an inner region and an outer region of the flexible film substrate, the cut-line partially surrounding the inner region. The semiconductor package further includes first interconnection lines extending in the inner region from a first side of the chip mounting region towards an edge of the inner region of the flexible film substrate, and second interconnection lines extending in the outer region from a second side of the chip mounting region towards an edge of the outer region of the flexible film substrate. The edge of the inner region and the edge of the outer region are located on the first side of the semiconductor chip.