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公开(公告)号:US20120019566A1
公开(公告)日:2012-01-26
申请号:US13137995
申请日:2011-09-23
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: G09G5/10
CPC分类号: G09G3/3688 , G09G3/2011 , G09G2330/02 , G09G2330/04 , H01L2224/05553
摘要: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.
摘要翻译: 集成电路装置包括第一至第N电路块CB1至CBN,沿第一至第N电路块CB1至CBN的第四侧和第二侧设置的第一接口区域以及沿着第二侧设置的第二接口区域, 在第一至第N电路块CB1至CBN的D4侧。 使用低于第I层的布线层形成的局部线LLG设置在相邻的电路块之间,作为信号线和电源线中的至少一个。 使用第I或更高布线层形成的全局线GLG和GLD沿着方向D1设置在布置在不相邻电路块之间的电路块上,作为信号线和电源线中的至少一个。
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公开(公告)号:US08054710B2
公开(公告)日:2011-11-08
申请号:US11477670
申请日:2006-06-30
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: G11C8/00
CPC分类号: G09G3/3688 , G09G3/2011 , G09G2330/02 , G09G2330/04 , H01L2224/05553
摘要: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.
摘要翻译: 集成电路装置包括第一至第N电路块CB1至CBN,沿第一至第N电路块CB1至CBN的第四侧和第二侧设置的第一接口区域以及沿着第二侧设置的第二接口区域, 在第一至第N电路块CB1至CBN的D4侧。 使用低于第I层的布线层形成的局部线LLG设置在相邻的电路块之间,作为信号线和电源线中的至少一个。 使用第I或更高布线层形成的全局线GLG和GLD沿着方向D1设置在布置在不相邻电路块之间的电路块上,作为信号线和电源线中的至少一个。
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公开(公告)号:US08547722B2
公开(公告)日:2013-10-01
申请号:US13137995
申请日:2011-09-23
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: G11C5/06
CPC分类号: G09G3/3688 , G09G3/2011 , G09G2330/02 , G09G2330/04 , H01L2224/05553
摘要: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.
摘要翻译: 集成电路装置包括第一至第N电路块CB1至CBN,沿第一至第N电路块CB1至CBN的第四侧和第二侧设置的第一接口区域以及沿着第二侧设置的第二接口区域, 在第一至第N电路块CB1至CBN的D4侧。 使用低于第I层的布线层形成的局部线LLG设置在相邻的电路块之间,作为信号线和电源线中的至少一个。 使用第I或更高布线层形成的全局线GLG和GLD沿着方向D1设置在布置在不相邻电路块之间的电路块上,作为信号线和电源线中的至少一个。
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公开(公告)号:US20070013635A1
公开(公告)日:2007-01-18
申请号:US11477742
申请日:2006-06-30
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: G09G3/36
CPC分类号: G09G3/3674 , G09G3/3685
摘要: An integrated circuit device includes a data driver block DB, a memory block MB, and a logic circuit block LB. The data driver block DB includes a data driver DR and a buffer circuit BF which buffers a driver control signal from the logic circuit block LB and outputs the buffered driver control signal to the data driver DR. The memory block MB includes a memory cell array MA and a row address decoder RD which selects a wordline. The data driver block DB and the memory block MB are disposed along a direction D1, the buffer circuit BF and the data driver DR are disposed along a direction D2, the row address decoder RD and the memory cell array MA are disposed along the direction D2, and the buffer circuit BF and the row address decoder RD are disposed along the direction D1.
摘要翻译: 集成电路装置包括数据驱动块DB,存储块MB和逻辑电路块LB。 数据驱动器块DB包括数据驱动器DR和缓冲电路BF,其缓冲来自逻辑电路块LB的驱动器控制信号,并将缓冲的驱动器控制信号输出到数据驱动器DR。 存储块MB包括选择字线的存储单元阵列MA和行地址解码器RD。 数据驱动块DB和存储块MB沿着方向D1设置,缓冲电路BF和数据驱动器DR沿着方向D 2设置,行地址解码器RD和存储单元阵列MA沿着 方向D 2,并且缓冲电路BF和行地址解码器RD沿着方向D1设置。
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公开(公告)号:US20070001982A1
公开(公告)日:2007-01-04
申请号:US11477670
申请日:2006-06-30
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: G09G3/36
CPC分类号: G09G3/3688 , G09G3/2011 , G09G2330/02 , G09G2330/04 , H01L2224/05553
摘要: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.
摘要翻译: 集成电路装置包括第一至第N电路块CB 1至CBN,沿着第一至第N电路块CB 1至CBN的第四侧和第二侧设置的第一接口区域,以及沿着第二至第N电路块 并且在第一至第N电路块CB 1至CBN的D4侧。 使用低于第I层的布线层形成的局部线LLG设置在相邻的电路块之间,作为信号线和电源线中的至少一个。 使用第I或更高布线层形成的全局线GLG和GLD沿着方向D1设置在布置在不相邻电路块之间的电路块上,作为信号线和电源线中的至少一个。
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公开(公告)号:US20070001886A1
公开(公告)日:2007-01-04
申请号:US11477646
申请日:2006-06-30
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
IPC分类号: H03M1/66
CPC分类号: G09G3/3611 , G09G3/3648 , G09G3/3696 , G09G2360/18
摘要: An integrated circuit device includes a driver macrocell in which a plurality of circuit blocks are integrated into a macrocell. The driver macrocell includes a data driver block DB for driving data lines, a memory block MB which stores image data, and a pad block PDB in which pads for electrically connecting output lines of the data driver block DB with the data lines are disposed. The data driver block DB and the memory block MB are disposed along a direction D1, and the pad block PDB is disposed on the D2 side of the data driver block DB and the memory block MB.
摘要翻译: 集成电路装置包括驱动器宏单元,其中多个电路块集成到宏单元中。 驱动器宏单元包括用于驱动数据线的数据驱动器块DB,存储图像数据的存储器块MB和用于电连接数据驱动器块DB的输出线与数据线的焊盘的焊盘块PDB。 数据驱动块DB和存储块MB沿着方向D1设置,并且焊盘块PDB设置在数据驱动块DB和存储块MB的D 2侧。
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公开(公告)号:US08547773B2
公开(公告)日:2013-10-01
申请号:US11477714
申请日:2006-06-30
申请人: Takayuki Saiki , Satoru Ito , Masahiko Moriguchi , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Kazuhiro Maekawa
发明人: Takayuki Saiki , Satoru Ito , Masahiko Moriguchi , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Kazuhiro Maekawa
IPC分类号: G11C8/00
CPC分类号: G09G3/3674 , G09G3/3685
摘要: An integrated circuit device includes at least one data driver block for driving data lines, a plurality of control transistors TC1 and TC2, each of the control transistors being provided corresponding to each output line of the data driver block and controlled by using a common control signal, and a pad arrangement region in which data driver pads P1 and P2 for electrically connecting the data lines and the output lines QL1 and QL2 of the data driver block are disposed. The control transistors TC1 and TC2 are disposed in the pad arrangement region.
摘要翻译: 集成电路装置包括用于驱动数据线的至少一个数据驱动器块,多个控制晶体管TC1和TC2,每个控制晶体管对应于数据驱动器模块的每个输出线提供,并通过使用公共控制信号 以及其中设置用于电连接数据线和数据驱动器块的输出线QL1和QL2的数据驱动器焊盘P1和P2的焊盘布置区域。 控制晶体管TC1和TC2设置在焊盘布置区域中。
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公开(公告)号:US20070013634A1
公开(公告)日:2007-01-18
申请号:US11477714
申请日:2006-06-30
申请人: Takayuki Saiki , Satoru Ito , Masahiko Moriguchi , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Kazuhiro Maekawa
发明人: Takayuki Saiki , Satoru Ito , Masahiko Moriguchi , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Kazuhiro Maekawa
IPC分类号: G09G3/36
CPC分类号: G09G3/3674 , G09G3/3685
摘要: An integrated circuit device includes at least one data driver block for driving data lines, a plurality of control transistors TC1 and TC2, each of the control transistors being provided corresponding to each output line of the data driver block and controlled. by using a common control signal, and a pad arrangement region in which data driver pads P1 and P2 for electrically connecting the data lines and the output lines QL1 and QL2 of the data driver block are disposed. The control transistors TC1 and TC2 are disposed in the pad arrangement region.
摘要翻译: 集成电路装置包括用于驱动数据线的至少一个数据驱动器块,多个控制晶体管TC 1和TC 2,每个控制晶体管被提供对应于数据驱动器模块的每个输出线并被控制。 以及用于电连接数据驱动器块的数据线和输出线QL 1和QL 2的数据驱动器焊盘P 1和P 2的焊盘布置区域。 控制晶体管TC 1和TC 2设置在焊盘布置区域中。
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公开(公告)号:US20070001983A1
公开(公告)日:2007-01-04
申请号:US11477718
申请日:2006-06-30
申请人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira
发明人: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise , Junichi Karasawa , Satoru Kodaira
IPC分类号: G09G3/36
CPC分类号: G09G3/3688 , G09G5/363 , G09G2310/027 , G09G2320/0276 , G11C7/16
摘要: An integrated circuit device includes a data driver block for driving data lines. The data driver block includes a plurality of subpixel driver cells, each of which outputs a data signal corresponding to image data of one subpixel. When a direction along the long side of the subpixel driver cell is a direction D1 and a direction perpendicular to the first direction is a direction D2, the subpixel driver cells are disposed in the data driver block along the direction D1 and the direction D2. Pads are disposed on the D2 side of the data driver block. A rearrangement wiring region for rearranging the order of pull-out lines of output signals from the subpixel driver cells is provided in the arrangement region of the subpixel driver cells.
摘要翻译: 集成电路装置包括用于驱动数据线的数据驱动器块。 数据驱动器块包括多个子像素驱动器单元,每个子像素驱动器单元输出与一个子像素的图像数据相对应的数据信号。 当沿着子像素驱动单元的长边的方向是方向D1并且垂直于第一方向的方向是方向D 2时,子像素驱动单元沿方向D1设置在数据驱动器块中,方向 D 2.垫子放置在数据驱动器块的D 2侧。 在子像素驱动器单元的配置区域中设置有用于重新排列来自子像素驱动器单元的输出信号的拉出线的顺序的重排布线区域。
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公开(公告)号:US20070002509A1
公开(公告)日:2007-01-04
申请号:US11477720
申请日:2006-06-30
申请人: Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
发明人: Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
IPC分类号: H02H9/00
CPC分类号: G09G3/3688 , G02F1/13452 , G02F2202/28 , G09G3/3696 , G09G2300/0426 , G09G2310/027
摘要: An integrated circuit device includes a pad PDx and an electrostatic discharge protection element ESDx formed in a rectangular region and electrically connected with the pad PDx. The pad PDx is disposed in an upper layer of the electrostatic discharge protection element ESDx so that an arrangement direction of the pads is parallel to a long side direction of the region in which the electrostatic discharge protection element ESDx is formed, and the pad PDx overlaps part or the entirety of the electrostatic discharge protection element ESDx.
摘要翻译: 集成电路器件包括形成在矩形区域中并与焊盘PDx电连接的焊盘PDx和静电放电保护元件ESDx。 垫PDx设置在静电放电保护元件ESDx的上层中,使得焊盘的布置方向平行于形成有静电放电保护元件ESDx的区域的长边方向,并且焊盘PDx重叠 部分或全部静电放电保护元件ESDx。
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