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    Friction-plate lubricating device for automatic transmission
    3.
    发明授权
    Friction-plate lubricating device for automatic transmission 失效
    用于自动变速器的摩擦板润滑装置

    公开(公告)号：US08715125B2

    公开(公告)日：2014-05-06

    申请号：US13353945

    申请日：2012-01-19

    申请人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo

    发明人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo

    IPC分类号： F16H15/50

    CPC分类号： F16D25/123 ,  F16H57/0473 ,  F16H57/0484 ,  F16H63/3026

    摘要： A friction-plate lubricating device for an automatic transmission that includes a friction engagement element with a plurality of friction plates in which outer friction plates and inner friction plates are alternately disposed; a hub with splines engaged with teeth formed on an inner circumference of the inner friction plates, the hub having the splines on an outer circumference thereof and having uneven portions formed on an inner circumference thereof; and a nozzle that discharges lubricant to the uneven portions. Recesses of the uneven portions serve as oil reservoirs in which the lubricant gathers, and through-holes are formed in bottom surfaces of the recesses. The lubricant discharged from the nozzle is collected in the oil reservoirs formed by the recesses so as to be supplied to the plurality of friction plates of the friction engagement element through the through-holes.

    摘要翻译： 一种用于自动变速器的摩擦片润滑装置，其包括具有多个摩擦板的摩擦接合元件，其中外摩擦板和内摩擦板交替设置; 具有形成在所述内摩擦板的内周上的齿形花键的轮毂，所述轮毂在其外周上具有所述花键，并且在其内周上形成有凹凸部; 以及向不均匀部分排出润滑剂的喷嘴。 不均匀部分的凹陷用作润滑剂聚集的储油器，并且在凹槽的底表面中形成通孔。 从喷嘴排出的润滑剂被收集在由凹部形成的储油器中，以通过通孔供给到摩擦接合元件的多个摩擦板。

    Hybrid Drive Device
    4.
    发明申请
    Hybrid Drive Device 有权
    混合驱动装置

    公开(公告)号：US20130213043A1

    公开(公告)日：2013-08-22

    申请号：US13762839

    申请日：2013-04-24

    申请人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo ,  Osamu Murai

    发明人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo ,  Osamu Murai

    IPC分类号： F02B63/04

    CPC分类号： F02B63/04 ,  B60K6/40 ,  B60K6/48 ,  B60K2006/4825 ,  F16D25/123 ,  F16D2300/0214 ,  Y02T10/6221 ,  Y02T10/6252

    摘要： A hybrid drive device having an engine coupling shaft member, a speed change mechanism, a rotating electrical machine, and an engine connecting clutch. A first lubricating oil passage scatters lubricating oil from radially inside to radially outside of first and second friction plates. A first one-way clutch is interposed between an engine coupling shaft member and a coupling member, and is configured to not be engaged when rotation of the engine coupling shaft member becomes lower than rotation of the coupling member. A second one-way clutch is configured not to be engaged when rotation of the rotating electrical machine becomes lower than rotation of the coupling member. An engine driven oil pump generates an oil pressure to be supplied by a driving force of the internal combustion engine or a driving force of the rotating electrical machine regardless of engagement or disengagement of the engine connecting clutch.

    摘要翻译： 具有发动机联轴器构件，变速机构，旋转电机和发动机连接离合器的混合动力驱动装置。 第一润滑油通道从第一和第二摩擦板的径向内侧向径向外侧分散润滑油。 第一单向离合器设置在发动机联接轴构件和联接构件之间，并且构造成在发动机联接轴构件的旋转变得低于联接构件的旋转时不接合。 第二单向离合器构造为在旋转电机的旋转变得低于联接构件的旋转时不接合。 发动机驱动的油泵不管发动机连接离合器的接合或分离如何，都会产生由内燃机的驱动力供给的油压或旋转电机的驱动力。

    Hybrid drive device
    5.
    发明授权
    Hybrid drive device 有权
    混合驱动装置

    公开(公告)号：US09528436B2

    公开(公告)日：2016-12-27

    申请号：US13762839

    申请日：2013-02-08

    申请人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo ,  Osamu Murai

    发明人： Satoru Kasuya ,  Masashi Kito ,  Yuichi Seki ,  Ryosuke Kondo ,  Osamu Murai

    IPC分类号： B60K6/48 ,  B60K17/02 ,  F16D25/12 ,  F02B63/04 ,  B60K6/40

    CPC分类号： F02B63/04 ,  B60K6/40 ,  B60K6/48 ,  B60K2006/4825 ,  F16D25/123 ,  F16D2300/0214 ,  Y02T10/6221 ,  Y02T10/6252

    摘要： A hybrid drive device having an engine coupling shaft member, a speed change mechanism, a rotating electrical machine, and an engine connecting clutch. A first lubricating oil passage scatters lubricating oil from radially inside to radially outside of first and second friction plates. A first one-way clutch is interposed between an engine coupling shaft member and a coupling member, and is configured to not be engaged when rotation of the engine coupling shaft member becomes lower than rotation of the coupling member. A second one-way clutch is configured not to be engaged when rotation of the rotating electrical machine becomes lower than rotation of the coupling member. An engine driven oil pump generates an oil pressure to be supplied by a driving force of the internal combustion engine or a driving force of the rotating electrical machine regardless of engagement or disengagement of the engine connecting clutch.

    摘要翻译： 具有发动机联轴器构件，变速机构，旋转电机和发动机连接离合器的混合动力驱动装置。 第一润滑油通道从第一和第二摩擦板的径向内侧向径向外侧分散润滑油。 第一单向离合器设置在发动机联接轴构件和联接构件之间，并且构造成在发动机联接轴构件的旋转变得低于联接构件的旋转时不接合。 第二单向离合器构造为在旋转电机的旋转变得低于联接构件的旋转时不接合。 发动机驱动的油泵不管发动机连接离合器的接合或分离如何，都会产生由内燃机的驱动力供给的油压或旋转电机的驱动力。

    OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
    6.
    发明申请
    OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME 审中-公开
    光学半导体装置及其制造方法

    公开(公告)号：US20100123162A1

    公开(公告)日：2010-05-20

    申请号：US12621035

    申请日：2009-11-18

    申请人： Ryosuke Kondo ,  Takaaki Sakai

    发明人： Ryosuke Kondo ,  Takaaki Sakai

    IPC分类号： H01L33/48 ,  H01L31/02

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optical semiconductor apparatus can be configured by mounting an optical semiconductor element on a package substrate using a solder paste. The optical semiconductor apparatus can include a package substrate and a metal die pad formed on the substrate, and an optical semiconductor element bonded to the die pad with a solder material. The substrate can be made of a ceramic base material. A plurality of through holes can be formed in the substrate so that the through holes penetrate both the substrate base material and the die pad. Each of the through holes can have an inner surface where the ceramic base material is exposed. Each through hole can have an opening diameter greater than or equal to 40 μm and less than or equal to 100 μm. The plurality of through holes can be formed such that the total area of the openings of the through holes is 50% or less of the bonded area between the optical semiconductor element and the die pad including the through holes covered with the solder material. The through holes can be covered with the solder material at the upper end thereof where the optical semiconductor element and the die pad are bonded to each other.

    摘要翻译： 可以使用焊膏将光学半导体元件安装在封装基板上来构成光学半导体装置。 光学半导体装置可以包括形成在基板上的封装基板和金属管芯焊盘，以及用焊料材料接合到管芯焊盘的光学半导体元件。 基板可以由陶瓷基材制成。 可以在基板中形成多个通孔，使得贯通孔贯穿基板基材和芯片基板。 每个通孔可以具有暴露陶瓷基材的内表面。 每个通孔可具有大于或等于40μm且小于或等于100μm的开口直径。 可以形成多个通孔，使得通孔的开口总面积为包含被焊料材料覆盖的通孔的光半导体元件与管芯焊盘之间的接合面积的50％以下。 通孔可以在光学半导体元件和芯片焊盘彼此结合的上端被焊料材料覆盖。

    Light emitting device and manufacturing method thereof
    7.
    发明授权
    Light emitting device and manufacturing method thereof 有权
    发光元件及其制造方法

    公开(公告)号：US08659047B2

    公开(公告)日：2014-02-25

    申请号：US13104259

    申请日：2011-05-10

    申请人： Ryosuke Kondo

    发明人： Ryosuke Kondo

    IPC分类号： H01L33/00

    CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.

    摘要翻译： 发光器件包括在其主表面上具有元件安装区域的衬底。 发光装置还包括安装在基板的元件安装区域中的至少一个发光元件。 发光装置还包括设置在基板上的传热构件。 传热部件具有与基板的导热性不同的导热性，从而在元件安装区域中形成不均匀的热阻分布。 通过基板的散热路径中的热阻，用于释放从发光元件发出的热量随着发光元件的安装位置而变化。