Abstract:
The present disclosure relates to systems and methods using thermal vias to increase the current-carrying capacity of conductive traces on a multilayered printed circuit board (PCB). In various embodiments, parameters associated with vias may be selected to control various electrical and thermal properties of the conductive trace. Such parameters include the via diameter, a plating thickness, a number of vias, a placement of the vias, an amount of conductive material to be added or removed from the conductive trace, a change in the resistance of the conductive trace, a change in a fusing measurement of the conductive trace, and the like.
Abstract:
The present disclosure relates to systems and methods using thermal vias to increase the current-carrying capacity of conductive traces on a multilayered printed circuit board (PCB). In various embodiments, parameters associated with vias may be selected to control various electrical and thermal properties of the conductive trace. Such parameters include the via diameter, a plating thickness, a number of vias, a placement of the vias, an amount of conductive material to be added or removed from the conductive trace, a change in the resistance of the conductive trace, a change in a fusing measurement of the conductive trace, and the like.
Abstract:
The present disclosure relates to systems and methods using thermal vias to increase the current-carrying capacity of conductive traces on a multilayered printed circuit board (PCB). In various embodiments, parameters associated with vias may be selected to control various electrical and thermal properties of the conductive trace. Such parameters include the via diameter, a plating thickness, a number of vias, a placement of the vias, an amount of conductive material to be added or removed from the conductive trace, a change in the resistance of the conductive trace, a change in a fusing measurement of the conductive trace, and the like.
Abstract:
The present disclosure provides systems and methods for identifying changes in and failures of a reference voltage of an analog to digital (A/D) converter. A non-scalar function of the reference voltage of the A/D converter can be determined and output to the A/D converter. The A/D converter is configured to output a digital value to the A/D conversion system, wherein the digital value corresponds to the non-scalar function of the reference voltage. The A/D conversion system decodes the non-scalar function of the reference voltage with a corresponding inverse function, and may determine the drift factor associated with the reference voltage. The A/D conversion system can report a change in, or a failure of, the A/D converter or its reference voltage, and can operate or prevent operation of protection elements.
Abstract translation:本公开提供用于识别模数(A / D)转换器的参考电压的变化和失败的系统和方法。 可以确定A / D转换器的参考电压的非标量函数并将其输出到A / D转换器。 A / D转换器被配置为向A / D转换系统输出数字值,其中数字值对应于参考电压的非标量函数。 A / D转换系统用对应的反函数对参考电压的非标量函数进行解码,并且可以确定与参考电压相关的漂移因子。 A / D转换系统可以报告A / D转换器或其参考电压的变化或故障,并可以操作或防止保护元件的工作。