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    Package for superconducting devices
    1.
    发明授权
    Package for superconducting devices 失效
    超导器件封装

    公开(公告)号：US4980754A

    公开(公告)日：1990-12-25

    申请号：US428673

    申请日：1989-10-30

    申请人： Seigo Kotani ,  Hiroyuki Sakai ,  Toshikazu Takenouchi ,  Fumio Miyagawa

    发明人： Seigo Kotani ,  Hiroyuki Sakai ,  Toshikazu Takenouchi ,  Fumio Miyagawa

    IPC分类号： H01L39/04 ,  H01L23/44

    CPC分类号： H01L23/445 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3011

    摘要： A package for superconducting devices, enabling signal transmission at a small propagation delay between superconducting devices provided within a heat insulating vacuum vessel, and semiconductor devices provided outside the heat insulating vacuum vessel. The package comprises a heat insulating vacuum vessel capable of maintaining the interior thereof at a low temperature, a substrate having mounted thereon superconducting devices and disposed within the heat insulating vacuum vessel, another substrate having mounted thereon semiconductor devices and disposed outside the heat insulating vacuum vessel, and film cables electrically connecting the respective circuit patterns of these substrates. Since the thickness of the film cables are very small, the rate of influx of heat that flows into the heat insulating vacuum vessel can be limited to a low value.

    Process for making a metal wall of a package used for accommodating electronic elements
    4.
    发明授权
    Process for making a metal wall of a package used for accommodating electronic elements 失效
    用于制造用于容纳电子元件的包装的金属壁的方法

    公开(公告)号：US5277357A

    公开(公告)日：1994-01-11

    申请号：US882967

    申请日：1992-05-14

    申请人： Takaharu Miyamoto ,  Fumio Miyagawa ,  Tsutomu Higuchi

    发明人： Takaharu Miyamoto ,  Fumio Miyagawa ,  Tsutomu Higuchi

    IPC分类号： H01L21/50 ,  H01L23/04 ,  H01L23/057 ,  H01R43/16

    CPC分类号： H01L23/04 ,  H01L21/50 ,  H01L23/057 ,  H01L2924/0002

    摘要： A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship. The abutting ends of the metal strip, as folded to form the metal sidewall, are affixed and hermetically sealed together and the lower edge of the metal sidewall, as formed from the folded strip, is affixed and hermetically sealed to the bottom plate to complete the metal wall enclosure. The at least one aperture is at a predetermined position in the metal wall enclosure and of a size for receiving a connector for providing a connection therethrough, and thus from the exterior of the package and through the enclosure, to the electronic element housed within the package.

    摘要翻译： 一种用于制造用于容纳电子元件的包装的金属壁外壳的方法。 形成为外壳的金属侧壁的细长条以及用于封闭金属侧壁的开口端的底板由一片金属原料形成。 至少一个孔被选择性地设置在底板和平面金属带中的至少一个中。 该条被准备用于折叠，例如沿着与金属侧壁的角部相对应的预定折叠线形成在条带中的横向槽，以便于将带条折叠成金属侧壁的期望配置，并且带的相对端部 ，以折叠形成金属侧壁，处于邻接关系。 折叠形成金属侧壁的金属带的邻接端被固定并密封在一起，金属侧壁的下部边缘（由折叠的条带形成）被固定并气密地密封到底板上以完成 金属围墙。 所述至少一个孔位于所述金属壁外壳中的预定位置处，并且具有用于接收用于提供穿过其中的连接的连接器的尺寸，并且因此从所述封装的外部并通过所述外壳到所述封装内的所述电子元件 。