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    MODIFIED NAPHTHALENE FORMALDEHYDE RESIN, TRICYCLODECANE SKELETON-CONTAINING NAPHTHOL COMPOUND AND ESTER COMPOUND
    6.
    发明申请
    MODIFIED NAPHTHALENE FORMALDEHYDE RESIN, TRICYCLODECANE SKELETON-CONTAINING NAPHTHOL COMPOUND AND ESTER COMPOUND 有权
    修饰的萘甲醛甲醛树脂，三羟甲基纤维素含骨架化合物和酯化合物

    公开(公告)号：US20110009574A1

    公开(公告)日：2011-01-13

    申请号：US12746611

    申请日：2008-12-04

    申请人： Seiji Kita ,  Masashi Ogiwara ,  Mitsuharu Kitamura ,  Dai Oguro ,  Gou Higashihara

    发明人： Seiji Kita ,  Masashi Ogiwara ,  Mitsuharu Kitamura ,  Dai Oguro ,  Gou Higashihara

    IPC分类号： C08G10/04 ,  C07C45/67 ,  C07C49/573 ,  C07C67/00 ,  C07C69/773

    CPC分类号： C07C45/68 ,  C07C67/14 ,  C07C69/753 ,  C07C2603/68 ,  C08G8/28 ,  G03F7/094 ,  C07C49/83

    摘要： A modified dimethylnaphthalene formaldehyde resin is disclosed, which is excellent in heat resistance and useful for thermosetting resins which are used for an electrical insulating material, a resin for resist, a semiconductor sealing resin, an adhesive for printed wiring board, a matrix resin for electrical laminate or prepreg to be mounted in electrical instruments, electronic instruments, industrial instruments, etc., a buildup laminate material, a resin for fiber-reinforced plastic, a sealing resin for liquid crystal display panel, a paint, a variety of coating agents, an adhesive, a laminate for electrical or electronic parts, a molded article, a coating material, a sealing material and the like, the modified dimethylnaphthalene formaldehyde resin being obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] (provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included).

    摘要翻译： 公开了一种改性的二甲基萘甲醛树脂，其耐热性优异，可用于电绝缘材料，抗蚀树脂，半导体密封树脂，印刷线路板用粘合剂，电气用基体树脂 电子仪器，工业仪器等的叠层或预浸料，堆积层压材料，纤维增强塑料用树脂，液晶显示面板用密封树脂，油漆，各种涂布剂， 粘合剂，电气或电子部件的层压体，成型体，涂料，密封材料等，改性的二甲基萘甲醛树脂是通过改性由具有下列通式表示的构成单元的多官能二甲基萘甲醛树脂 [1]在其分子中具有至少一个选自基团的成员 由以下通式[2]表示的苯酚，由以下通式[3]表示的萘酚和由以下通式[4]表示的萘酚（条件是至少任意一种由通式 式[3]所示的萘酚或通式[4]表示的萘酚）。

    Aromatic hydrocarbon resin and composition for forming underlayer film for lithography
    7.
    发明授权
    Aromatic hydrocarbon resin and composition for forming underlayer film for lithography 有权
    芳族烃树脂和用于形成用于光刻的下层膜的组合物

    公开(公告)号：US08586289B2

    公开(公告)日：2013-11-19

    申请号：US13395947

    申请日：2010-09-14

    申请人： Ryuji Ideno ,  Seiji Kita ,  Masashi Ogiwara ,  Gou Higashihara

    发明人： Ryuji Ideno ,  Seiji Kita ,  Masashi Ogiwara ,  Gou Higashihara

    IPC分类号： G03F7/11 ,  G03F7/40

    CPC分类号： C08G10/02 ,  C08G61/02 ,  C08G2261/148 ,  C08G2261/342 ,  C08G2261/42 ,  C08L65/00 ,  C09D161/18 ,  G03F7/11

    摘要： The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

    摘要翻译： 芳族烃树脂可以用作半导体的涂料和抗蚀剂树脂，并且具有高的碳浓度和低的氧浓度。 公开了一种用于形成用于光刻的下层膜的组合物，其具有优异的耐蚀刻性，作为用于多层抗蚀剂工艺的下层膜，使用其形成的下层膜以及使用其的图案形成方法。 芳族烃与芳族醛在酸性催化剂存在下反应，从而提供具有90至99.9质量％的高碳浓度和0至5质量％的低氧浓度的芳族烃树脂 。 用于形成用于光刻的下层膜的组合物包含树脂和有机溶剂，由此形成下层膜，并且图案形成方法使用它。

    AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY
    8.
    发明申请
    AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY 有权
    用于形成底层膜的芳族碳氢化合物和组合物

    公开(公告)号：US20120171611A1

    公开(公告)日：2012-07-05

    申请号：US13395947

    申请日：2011-03-24

    申请人： Ryuji Ideno ,  Seiji Kita ,  Masashi Ogiwara ,  Gou Higashihara

    发明人： Ryuji Ideno ,  Seiji Kita ,  Masashi Ogiwara ,  Gou Higashihara

    IPC分类号： C08G10/02 ,  G03F7/20 ,  G03F7/004 ,  C09D161/18

    CPC分类号： C08G10/02 ,  C08G61/02 ,  C08G2261/148 ,  C08G2261/342 ,  C08G2261/42 ,  C08L65/00 ,  C09D161/18 ,  G03F7/11

    摘要： The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

    摘要翻译： 芳族烃树脂可以用作半导体的涂料和抗蚀剂树脂，并且具有高的碳浓度和低的氧浓度。 公开了一种用于形成用于光刻的下层膜的组合物，其具有优异的耐蚀刻性，作为用于多层抗蚀剂工艺的下层膜，使用其形成的下层膜以及使用其的图案形成方法。 芳族烃与芳族醛在酸性催化剂存在下反应，从而提供具有90至99.9质量％的高碳浓度和0至5质量％的低氧浓度的芳族烃树脂 。 用于形成用于光刻的下层膜的组合物包含树脂和有机溶剂，由此形成下层膜，并且图案形成方法使用它。