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公开(公告)号：US20160133456A1
公开(公告)日：2016-05-12
申请号：US14931004
申请日：2015-11-03
Applicant: Semes Co., Ltd.
Inventor： Kihoon CHOI , In-Il JUNG , Seong-Soo KIM , Yoon-Jong JU
CPC classification number: H01L21/02057 , B24C1/003 , B24C11/005 , H01L21/02052 , H01L21/67051
Abstract: Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.
Abstract translation: 公开了一种处理基板的装置和方法。 该方法包括将清洁颗粒供应到基底以清洁基底。 清洁颗粒是固体颗粒。 固体颗粒向基材提供冲击波。
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公开(公告)号：US20160118241A1
公开(公告)日：2016-04-28
申请号：US14879389
申请日：2015-10-09
Applicant: Semes Co., Ltd.
Inventor： Seong Soo LEE , Keunje JO , Soon Kab KWON , Jong Han KIM , Bok Kyu LEE , Yoon-Jong JU
IPC: H01L21/02 , B08B3/10 , B08B3/02 , H01L21/67 , H01L21/687
CPC classification number: B08B3/102 , B08B3/024 , H01L21/67051 , H01L21/6715
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.
Abstract translation: 公开了一种基板处理装置。 基板处理装置包括限定用于在其中处理基板的空间的壳体，支撑并旋转基板在壳体中的旋转头，喷射单元，其包括用于将第一处理溶液喷射在放置在旋转头上的基板上的第一喷嘴构件 ，以及控制喷雾单元的控制器。 控制器喷射第一处理溶液，同时将第一喷嘴构件在衬底的边缘和中心区域之间以及衬底上方移动。 所述控制器不同地调节所述第一处理液喷射到所述基板的边缘区域上的第一高度以及所述第一处理溶液喷射到所述基板的中心区域的第二高度。
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