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公开(公告)号：US20240165758A1
公开(公告)日：2024-05-23
申请号：US18485701
申请日：2023-10-12
Applicant: SEMES CO., LTD.
Inventor： Jeong Yeong PARK , Seong Soo LEE
Abstract: Disclosed are a substrate processing apparatus and a substrate processing method capable of improving processing uniformity of a substrate. The substrate processing apparatus includes a body configured to spin-rotate; a plurality of support pins installed on the body so as to support the substrate thereon; a plurality of chuck pins installed on the body so as to grip a side surface of the substrate; a chuck pin driver device configured to move the chuck pin from a stand-by position to a grip position when the substrate has been seated on the support pin; and a support pin spacing device configured to space the substrate and at least one of the support pins from each other while the chuck pin is gripping the substrate.
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公开(公告)号：US20230366100A1
公开(公告)日：2023-11-16
申请号：US18298416
申请日：2023-04-11
Applicant: SEMES CO., LTD.
Inventor： Min Jung KIM , Seong Soo LEE , Jun Kil HWANG
IPC: C23F1/08
CPC classification number: C23F1/08
Abstract: A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.
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公开(公告)号：US20160118241A1
公开(公告)日：2016-04-28
申请号：US14879389
申请日：2015-10-09
Applicant: Semes Co., Ltd.
Inventor： Seong Soo LEE , Keunje JO , Soon Kab KWON , Jong Han KIM , Bok Kyu LEE , Yoon-Jong JU
IPC: H01L21/02 , B08B3/10 , B08B3/02 , H01L21/67 , H01L21/687
CPC classification number: B08B3/102 , B08B3/024 , H01L21/67051 , H01L21/6715
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.
Abstract translation: 公开了一种基板处理装置。 基板处理装置包括限定用于在其中处理基板的空间的壳体，支撑并旋转基板在壳体中的旋转头，喷射单元，其包括用于将第一处理溶液喷射在放置在旋转头上的基板上的第一喷嘴构件 ，以及控制喷雾单元的控制器。 控制器喷射第一处理溶液，同时将第一喷嘴构件在衬底的边缘和中心区域之间以及衬底上方移动。 所述控制器不同地调节所述第一处理液喷射到所述基板的边缘区域上的第一高度以及所述第一处理溶液喷射到所述基板的中心区域的第二高度。
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Patent Agency Ranking
公开(公告)号：US20240055276A1
公开(公告)日：2024-02-15
申请号：US18124277
申请日：2023-03-21
Applicant: SEMES CO., LTD.
Inventor： Seong Soo LEE , Dong Hee SON , Moon Sik CHOI
CPC classification number: H01L21/67017 , C02F1/68 , C02F2103/02
Abstract: A chemical liquid supply unit and a substrate processing apparatus including the same are proposed, which is capable of efficiently removing contaminants in a chemical liquid.
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公开(公告)号：US20230203672A1
公开(公告)日：2023-06-29
申请号：US18146489
申请日：2022-12-27
Applicant: SEMES CO., LTD.
Inventor： Jun Kil HWANG , Min Jung KIM , Hee Hwan KIM , Seong Soo LEE
CPC classification number: C23F1/46 , B08B3/022 , B08B3/08 , B08B3/041 , B08B2203/007 , H01L21/02057
Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.
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公开(公告)号：US20240058845A1
公开(公告)日：2024-02-22
申请号：US18231720
申请日：2023-08-08
Applicant: SEMES CO., LTD.
Inventor： Dong Hee SON , Seong Soo LEE , Jeong Bin LEE , Sun Mi KIM
CPC classification number: B08B3/02 , B08B13/00 , B08B3/08 , H01L21/67023
Abstract: A fluid supply device and a wafer cleaning apparatus using the same are proposed. The fluid supply device is improved to minimize occurrence of particles generated in an operational process in order to reduce contamination of a wafer. The fluid supply device includes a supply tube connected to a supply tank storing a liquid chemical and a supply valve, a drain tube connected to the supply tube by a branch tube and a drain valve, a fluid tank, a provision tube connected to the supply tube via the branch tube to provide the liquid chemical into the fluid tank, a supply valve, a tank drain tube connected to the fluid tank to drain a liquid chemical in the fluid tank, and a tank drain valve, and a controller configured to control opening and closing of each of the valves and supply of the liquid chemical supplying through the supply tube.
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公开(公告)号：US20230330768A1
公开(公告)日：2023-10-19
申请号：US18341838
申请日：2023-06-27
Applicant: SEMES CO., LTD.
Inventor： Soo Young PARK , Ohyeol KWON , Jun Keon AHN , Jung Hwan LEE , Seong Soo LEE
IPC: B23K26/0622 , B23K26/40 , B23K26/08
CPC classification number: B23K26/0622 , B23K26/0823 , B23K26/40 , B23K26/103
Abstract: Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.
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公开(公告)号：US20200346300A1
公开(公告)日：2020-11-05
申请号：US16862162
申请日：2020-04-29
Applicant: SEMES CO., LTD.
Inventor： Soo Young PARK , Ohyeol KWON , Jun Keon AHN , Jung Hwan LEE , Seong Soo LEE
IPC: B23K26/0622 , B23K26/40 , B23K26/08
Abstract: Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.
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