公开(公告)号：US20160343587A1

公开(公告)日：2016-11-24

申请号：US15226003

申请日：2016-08-02

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Motomu KURATA ,  Shinya SASAGAWA ,  Fumika TAGUCHI ,  Yoshinori IEDA

IPC: H01L21/3213 ,  H01L21/48 ,  H01L21/3105 ,  H01L23/522 ,  H01L23/528 ,  H01L27/12 ,  H01L23/535 ,  H01L21/768

CPC classification number: H01L27/1288 ,  H01L21/31053 ,  H01L21/32135 ,  H01L21/32139 ,  H01L21/486 ,  H01L21/76885 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/535 ,  H01L27/1214 ,  H01L27/1225 ,  H01L27/124

Abstract: It is an object to reduce defective conduction in a wiring board or a semiconductor device whose integration degree is increased. It is another object to manufacture a highly reliable wiring board or semiconductor device with high yield. In a wiring board or a semiconductor device having a multilayer wiring structure, a conductive layer having a curved surface is used in connection between conductive layers used for the wirings. The top of a conductive layer in a lower layer exposed by removal of an insulating layer therearound has a curved surface, so that coverage of the conductive layer in the lower layer with a conductive layer in an upper layer stacked thereover can be favorable. A conductive layer is etched using a resist mask having a curved surface, so that a conductive layer having a curved surface is formed.

Abstract translation: 本发明的目的是减少集成度增加的布线板或半导体器件的导通不良。 另一个目的是以高产率制造高度可靠的布线板或半导体器件。 在具有多层布线结构的布线板或半导体器件中，具有弯曲表面的导电层用于连接用于布线的导电层。 通过去除其周围的绝缘层而暴露的下层中的导电层的顶部具有弯曲表面，使得下层中的导电层与其上层叠的上层中的导电层的覆盖率可能是有利的。 使用具有弯曲表面的抗蚀剂掩模蚀刻导电层，从而形成具有弯曲表面的导电层。