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公开(公告)号:US20170271421A1
公开(公告)日:2017-09-21
申请号:US15456887
申请日:2017-03-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yasuhiro JINBO , Kohei YOKOYAMA , Yuki TAMATSUKURI , Naoto GOTO , Masami JINTYOU , Masayoshi DOBASHI , Masataka NAKADA , Akihiro CHIDA , Naoyuki SENDA
IPC: H01L27/32
CPC classification number: H01L27/3258 , H01L51/5253 , H01L2251/301 , H01L2251/5338
Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
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公开(公告)号:US20180247990A1
公开(公告)日:2018-08-30
申请号:US15966640
申请日:2018-04-30
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yasuhiro JINBO , Kohei YOKOYAMA , Yuki TAMATSUKURI , Naoto GOTO , Masami JINTYOU , Masayoshi DOBASHI , Masataka NAKADA , Akihiro CHIDA , Naoyuki SENDA
CPC classification number: H01L27/3258 , H01L51/5253 , H01L2251/301 , H01L2251/5338
Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
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公开(公告)号:US20210151486A1
公开(公告)日:2021-05-20
申请号:US16628073
申请日:2018-07-03
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Hidetomo KOBAYASHI , Yuki TAMATSUKURI , Naoto KUSUMOTO
IPC: H01L27/146
Abstract: An imaging device capable of executing image processing is provided.
A structure is employed in which a photoelectric conversion element, a first transistor, a second transistor, and an inverter circuit are included; one electrode of the photoelectric conversion element is electrically connected to one of a source and a drain of the first transistor; the other of the source and the drain of the first transistor is electrically connected to one of a source and a drain of the second transistor; the one of the source and the drain of the second transistor is electrically connected to an input terminal of the inverter circuit; and data obtained by photoelectric conversion is binarized and output.-
公开(公告)号:US20220216254A1
公开(公告)日:2022-07-07
申请号:US17705479
申请日:2022-03-28
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Hidetomo KOBAYASHI , Yuki TAMATSUKURI , Naoto KUSUMOTO
IPC: H01L27/146
Abstract: An imaging device capable of executing image processing is provided. A structure is employed in which a photoelectric conversion element, a first transistor, a second transistor, and an inverter circuit are included; one electrode of the photoelectric conversion element is electrically connected to one of a source and a drain of the first transistor; the other of the source and the drain of the first transistor is electrically connected to one of a source and a drain of the second transistor; the one of the source and the drain of the second transistor is electrically connected to an input terminal of the inverter circuit; and data obtained by photoelectric conversion is binarized and output.
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公开(公告)号:US20200242730A1
公开(公告)日:2020-07-30
申请号:US16636705
申请日:2018-08-23
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Masataka SHIOKAWA , Yuki TAMATSUKURI
Abstract: A semiconductor device which performs upconversion without a large amount of learning data is provided. The semiconductor device increasing the resolution of a first image data to generate a high-resolution image data. It includes the first step of generating a second image data by decreasing the resolution of the first image data, the second step of generating a third image data having a higher resolution than the second image data by inputting the second image data to a neural network, the third step of calculating an error for the third image data relative to the first image data by their comparison, and the fourth step of modifying a weight coefficient of the neural network on the basis of the error; and then the high resolution image data is generated by inputting the first image data into the neural network after a prescribed number of the second to fourth steps.
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