TRANSISTOR
    2.
    发明申请
    TRANSISTOR 审中-公开

    公开(公告)号:US20170358682A1

    公开(公告)日:2017-12-14

    申请号:US15610784

    申请日:2017-06-01

    Abstract: A transistor with a small footprint is provided. A transistor having high reliability is provided. A transistor is provided over an insulating layer that has a projection. Over the projection, at least a channel formation region of a semiconductor layer is provided. This can reduce the footprint of the transistor. The transistor has a curved structure, which inhibits light that enters from the outside from reaching a channel formation region of the semiconductor layer. Accordingly, deterioration of the transistor due to external light can be reduced, whereby the transistor can have increased reliability. The projection can be obtained by utilizing the internal stress of the layer formed over the insulating layer. Alternatively, the projection can be obtained by placing, under the insulating layer, a structure body for providing the insulating layer with the projection.

    DISPLAY DEVICE
    4.
    发明申请

    公开(公告)号:US20250017050A1

    公开(公告)日:2025-01-09

    申请号:US18709968

    申请日:2022-11-08

    Abstract: A display device in which crosstalk is inhibited is provided. The display device includes a first insulating layer including a first region and a second region having a lower top surface level than the first region, a second insulating layer including a region overlapping with the first region, a light-emitting device including a region overlapping with the first region with the second insulating layer therebetween, a stack including a region overlapping with the second region, and a third insulating layer including a region overlapping with the stack; the second insulating layer includes a protruding portion overlapping with the second region; the light-emitting device includes at least a light-emitting layer, a first upper electrode over the light-emitting layer, and a second upper electrode over the first upper electrode; the second upper electrode includes a region overlapping with the third insulating layer; and the stack contains the same material as the light-emitting layer.

    DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE DISPLAY APPARATUS

    公开(公告)号:US20250008818A1

    公开(公告)日:2025-01-02

    申请号:US18711284

    申请日:2022-11-21

    Abstract: A display apparatus with extremely high resolution is provided. A display apparatus with high display quality is provided. The display apparatus includes a first light-emitting element and a second light-emitting element over a first insulating layer, a second insulating layer, and a third insulating layer. The first light-emitting element includes a first pixel electrode and a first organic layer. The second light-emitting element includes a second pixel electrode and a second organic layer. The first insulating layer includes a groove-like region provided along a side of the first pixel electrode in a plan view. The groove-like region includes a first region overlapping with the first pixel electrode and a second region overlapping with the second pixel electrode. The first region and the second region each have a width greater than or equal to 20 nm and less than or equal to 500 nm. The second insulating layer includes a region in contact with a top surface of the first organic layer, a region in contact with a side surface of the first organic layer, and a region located below the first pixel electrode. The third insulating layer includes a region in contact with a top surface of the second organic layer, a region in contact with a side surface of the second organic layer, and a region located below the second pixel electrode.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220320340A1

    公开(公告)日:2022-10-06

    申请号:US17629802

    申请日:2020-07-27

    Abstract: A semiconductor device with favorable electrical characteristics is provided. A highly reliable semiconductor device is provided. The semiconductor device includes a semiconductor layer, a first insulating layer over the semiconductor layer, and a conductive layer over the first insulating layer. The semiconductor layer includes a first region, a pair of second regions, a pair of third regions, and a pair of fourth regions. The second regions sandwich the first region, the third regions sandwich the first region and the second regions, and the fourth regions sandwich the first region, the second regions, and the third regions. The first region includes a region overlapping with the first insulating layer and the conductive layer, the second regions and the third regions each include a region overlapping with the first insulating layer and not overlapping with the conductive layer, and the fourth regions overlap with neither the first insulating layer nor the conductive layer. A thickness of the first insulating layer in regions overlapping with the second regions is substantially equal to a thickness of the first insulating layer in a region overlapping with the first region. A thickness of the first insulating layer in regions overlapping with the third regions is smaller than the thickness of the first insulating layer in the regions overlapping with the second regions.

    METHOD OF FABRICATING DISPLAY DEVICE
    9.
    发明公开

    公开(公告)号:US20240324279A1

    公开(公告)日:2024-09-26

    申请号:US18260969

    申请日:2021-12-27

    CPC classification number: H10K59/1201 H10K59/122 H10K71/233

    Abstract: A method of fabricating a display device with high resolution is provided. A display device having both high display quality and high resolution is provided. The method of fabricating a display device includes steps of forming a first EL film and a first sacrificial film over a first pixel electrode and a second pixel electrode; etching the first sacrificial film to form a first sacrificial layer; etching the first EL film to form a first EL layer and to expose the second pixel electrode; forming a second EL film and a second sacrificial film; etching the second sacrificial film to form a second sacrificial layer; etching the second EL film to form a second EL layer; forming an insulating film covering the first sacrificial layer, the first EL layer, the second sacrificial layer, and the second EL layer; and etching the insulating film to form an insulating layer including a region in contact with a side surface of the first EL layer and a region in contact with a side surface of the second EL layer.

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