公开(公告)号：US20200044112A1

公开(公告)日：2020-02-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/12 ,  H01L33/54 ,  H01L31/0203 ,  G01S17/08

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

公开(公告)号：US11056607B2

公开(公告)日：2021-07-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/112 ,  G01S17/08 ,  H01L31/0203 ,  H01L33/54

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

公开(公告)号：US20250015206A1

公开(公告)日：2025-01-09

申请号：US18739901

申请日：2024-06-11

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Wen-Chieh Tsou

IPC: H01L31/0216 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/18

Abstract: The present invention discloses a light sensing device packaging structure and the packaging method thereof. The packaging structure comprises a substrate, a transparent molding substance, a first glass, and a sheltering element. A first optical element and a second optical element are disposed on the substrate. The transparent molding substance covers the first optical element and the second optical element. A bottom surface of the first glass is fixed on the transparent molding substance and aligned with the first optical element. The sheltering element covers the edge of the transparent molding substance not covered by the first glass. This design maintains the excellent optical sensing effect of the light sensing device while allowing for miniaturization of the overall structure.