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公开(公告)号：US20240425355A1
公开(公告)日：2024-12-26
申请号：US18242132
申请日：2023-09-05
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Shih-Hsiung TSENG , Shih-Wei LEE , Chao-Shiun WANG
IPC: B81B3/00 , G01C19/5712
Abstract: The present application provides a three-axis gyroscope, which comprises a substrate on which a first plate element, a second plate element, a third plate element, a first drive module, and a second drive module are disposed. The first driving module, the first plate element, the second plate element, the third plate element and the second driving module are disposed in an axial direction. Thereby, problems caused by use of frames and coupling flexible structures of three-axis gyroscopes available now may be solved effectively.
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公开(公告)号：US20240019297A1
公开(公告)日：2024-01-18
申请号：US18129908
申请日：2023-04-03
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Yu-Min Lin
CPC classification number: G01J1/4204 , G01J1/0488
Abstract: The present invention provides an ambient light sensing method and an ambient light sensor. The ambient light sensing method comprises a light sensing device sensing the light passing through an optical filter and giving an optical signal value, and an operational unit receiving the optical signal value and calculating an ambient light illuminance value according to the optical signal value. Accordingly, the ambient light sensing method and the ambient light sensor according to the present invention can give the ambient light illuminance value with more accuracy and ensure low influence of opaque ink on ambient light sensing.
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公开(公告)号：US20240017987A1
公开(公告)日：2024-01-18
申请号：US18129911
申请日：2023-04-03
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Shih-Wei Lee , Kuan-Ju Tseng , Chao-Shiun Wang
CPC classification number: B81B3/0072 , B81C3/001 , B81B2203/0307 , B81C2203/054
Abstract: The present application discloses an anchor structure for application to a microelectromechanical system device comprising a cap layer, a device layer and a substrate layer. Such an anchor structure enhances the stress tolerance of the microelectromechanical system device. The anchor structure comprises a first anchor portion, a second anchor portion and a flexible member located in the device layer. The first anchor portion and the second anchor portion are connected to two sides of the flexible member, respectively. The first anchor is secured to the cap layer by a first bonding portion, and the second anchor is secured to the substrate layer by a second bonding portion.
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公开(公告)号：US20230325034A1
公开(公告)日：2023-10-12
申请号：US18333936
申请日：2023-06-13
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： CHIH-YU LIN
CPC classification number: G06F3/04186 , G06F3/046
Abstract: A proximity sensor and a proximity sensing method are disclosed. The proximity sensor includes a sensing element and a sensing circuit. The sensing circuit is coupled to the sensing element and transmits a first driving signal and a second signal to the sensing element, respectively. The sensing element receives the first driving signal and the second driving signal, respectively, and generates a first sensing signal and a second sensing signal, respectively. The sensing circuit generates a proximity signal according to the first sensing signal and the second sensing signal. The accuracy of sensing the proximity of the human body whether near to the sensor is improved. In addition, the sensing circuit is further coupled to a radio-frequency circuit, and the sensing circuit transmits a driving signal or/and receives a sensing signal according to the state of the radio-frequency circuit, thereby reducing interference of the sensing circuit to the radio-frequency circuit.
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公开(公告)号：US11656120B2
公开(公告)日：2023-05-23
申请号：US17405254
申请日：2021-08-18
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Feng-Jung Hsu
IPC: G01J1/42
CPC classification number: G01J1/42
Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.
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Patent Agency Ranking
公开(公告)号：US10985770B2
公开(公告)日：2021-04-20
申请号：US16819583
申请日：2020-03-16
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor： Jer-Hau Hsu , Tsung-Han Wu , Kian-Fu Wong , Meng-Yong Lin
IPC: H03M1/08
Abstract: The present application relates to a method for operating sensing signals and the circuit thereof. An analog-to-digital converter first processes the input signal having the most significant bit (MSB DATA) data at least once. Afterwards, the analog-to-digital converter processes the input signal having the least significant bit (LSB) data and the MSB data and sums all the input signals. Thereby, the process steps of the analog-to-digital converter can be simplified and the processing time can be shortened.
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公开(公告)号：US20200044112A1
公开(公告)日：2020-02-06
申请号：US16512406
申请日：2019-07-16
Applicant: SensorTek technology Corp.
Inventor： Wen-Chieh Tsou , Yi-Hua Chang , Chih-Wei Chen
IPC: H01L31/12 , H01L33/54 , H01L31/0203 , G01S17/08
Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.
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公开(公告)号：US20190391008A1
公开(公告)日：2019-12-26
申请号：US16447976
申请日：2019-06-21
Applicant: SensorTek technology Corp.
Inventor： Feng-Jung Hsu
Abstract: An optical sensing module for an electronic device is provided. The electronic device includes an opaque layer and an aperture formed on the opaque layer, wherein the optical sensing module includes an optical sensor; a light guide element, disposed between the opaque layer and the optical sensor and configured to guide light to the optical sensor through the aperture; and a diffusing layer, disposed between the opaque layer and the light guide element, configured to diffuse the light to the light guide element.
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公开(公告)号：US20180203101A1
公开(公告)日：2018-07-19
申请号：US15871015
申请日：2018-01-14
Applicant: SensorTek technology Corp.
Inventor： Jer-Hau Hsu , Feng-Jung Hsu
CPC classification number: G01S7/4808 , G01S7/4813 , G01S7/493 , G01S17/026 , G01S17/32
Abstract: A sensing module includes a first sensor, for sensing a light signal to generate a first sensing signal including a first crosstalk component related to a crosstalk signal in the light signal; a second sensor, for sensing the light signal to generate a second sensing signal including a second crosstalk component related to the crosstalk signal; and an arithmetic unit, for combining the first sensing signal and the second sensing signal according to a ratio between the first crosstalk component and the second crosstalk component, to generate an output signal; wherein a distance between the first sensor and a light source generating the light signal is different from a distance between the second sensor and the light source.
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公开(公告)号：US20170227575A1
公开(公告)日：2017-08-10
申请号：US15093765
申请日：2016-04-08
Applicant: SensorTek technology Corp.
Inventor： Hsin-Hung Huang , Wei-Yang Ou , Hung-Sen Chen
IPC: G01P21/00 , G01C25/00 , G01C19/5783 , G01P15/08 , G01P15/125
CPC classification number: G01P21/00 , B81C99/0045 , G01C19/5783 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P2015/0814 , G01P2015/0831
Abstract: A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.
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