公开(公告)号：US20200044112A1

公开(公告)日：2020-02-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/12 ,  H01L33/54 ,  H01L31/0203 ,  G01S17/08

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

公开(公告)号：US09971060B2

公开(公告)日：2018-05-15

申请号：US15222926

申请日：2016-07-28

Applicant: SensorTek technology Corp.

Inventor： Huan-Hsiang Weng ,  Feng-Jung Hsu ,  Chu-Yuan Yang ,  Chih-Wei Chen ,  Yi-Hua Chang

IPC: H01L31/16 ,  G01V8/20 ,  G01J1/42 ,  G01J1/02 ,  G01S17/02 ,  G01S7/481 ,  G01S7/497

CPC classification number: G01V8/20 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/4204 ,  G01S7/481 ,  G01S7/497 ,  G01S17/026 ,  H01L31/16

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

公开(公告)号：US20170186886A1

公开(公告)日：2017-06-29

申请号：US15222926

申请日：2016-07-28

Applicant: SensorTek technology Corp.

Inventor： Huan-Hsiang Weng ,  Feng-Jung Hsu ,  Chu-Yuan Yang ,  Chih-Wei Chen ,  Yi-Hua Chang

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/14 ,  G01J1/42 ,  G01V8/20

CPC classification number: G01V8/20 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/4204 ,  G01S7/481 ,  G01S7/497 ,  G01S17/026 ,  H01L31/16

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

公开(公告)号：US11056607B2

公开(公告)日：2021-07-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/112 ,  G01S17/08 ,  H01L31/0203 ,  H01L33/54

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.