公开(公告)号：US09865765B2

公开(公告)日：2018-01-09

申请号：US14822906

申请日：2015-08-11

Applicant: SensorTek technology Corp.

Inventor： Feng-Jung Hsu ,  Chu-Yuan Yang ,  Yuan-Ching Hsu ,  Yi-Hua Chang

IPC: H01L31/12 ,  H01L31/18 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02 ,  G01S7/481

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

公开(公告)号：US20170186886A1

公开(公告)日：2017-06-29

申请号：US15222926

申请日：2016-07-28

Applicant: SensorTek technology Corp.

Inventor： Huan-Hsiang Weng ,  Feng-Jung Hsu ,  Chu-Yuan Yang ,  Chih-Wei Chen ,  Yi-Hua Chang

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/14 ,  G01J1/42 ,  G01V8/20

CPC classification number: G01V8/20 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/4204 ,  G01S7/481 ,  G01S7/497 ,  G01S17/026 ,  H01L31/16

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

公开(公告)号：US20200044112A1

公开(公告)日：2020-02-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/12 ,  H01L33/54 ,  H01L31/0203 ,  G01S17/08

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

公开(公告)号：US09971060B2

公开(公告)日：2018-05-15

申请号：US15222926

申请日：2016-07-28

Applicant: SensorTek technology Corp.

Inventor： Huan-Hsiang Weng ,  Feng-Jung Hsu ,  Chu-Yuan Yang ,  Chih-Wei Chen ,  Yi-Hua Chang

IPC: H01L31/16 ,  G01V8/20 ,  G01J1/42 ,  G01J1/02 ,  G01S17/02 ,  G01S7/481 ,  G01S7/497

CPC classification number: G01V8/20 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/4204 ,  G01S7/481 ,  G01S7/497 ,  G01S17/026 ,  H01L31/16

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

公开(公告)号：US20160111561A1

公开(公告)日：2016-04-21

申请号：US14822906

申请日：2015-08-11

Applicant: SensorTek technology Corp.

Inventor： Feng-Jung Hsu ,  Chu-Yuan Yang ,  Yuan-Ching Hsu ,  Yi-Hua Chang

IPC: H01L31/0232 ,  H01L31/12 ,  H01L31/18 ,  H01L31/0203

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

Abstract translation: 提供了具有光学屏障的封装结构。 用于发射光信号的发射器和用于接收光信号的检测器设置在基板上。 光学屏障设置在发射器和检测器之间，用于屏蔽多余的光信号。 封装材料用于完全覆盖光学屏障，发射器和检测器，使得光学屏障完全设置在封装材料内。

公开(公告)号：US11056607B2

公开(公告)日：2021-07-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/112 ,  G01S17/08 ,  H01L31/0203 ,  H01L33/54

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.