公开(公告)号：US20160111561A1

公开(公告)日：2016-04-21

申请号：US14822906

申请日：2015-08-11

Applicant: SensorTek technology Corp.

Inventor： Feng-Jung Hsu ,  Chu-Yuan Yang ,  Yuan-Ching Hsu ,  Yi-Hua Chang

IPC: H01L31/0232 ,  H01L31/12 ,  H01L31/18 ,  H01L31/0203

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

Abstract translation: 提供了具有光学屏障的封装结构。 用于发射光信号的发射器和用于接收光信号的检测器设置在基板上。 光学屏障设置在发射器和检测器之间，用于屏蔽多余的光信号。 封装材料用于完全覆盖光学屏障，发射器和检测器，使得光学屏障完全设置在封装材料内。

公开(公告)号：US20240044701A1

公开(公告)日：2024-02-08

申请号：US18234580

申请日：2023-08-16

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Li-Chien Su ,  Yen-Wei Liao ,  Yuan-Ching Hsu

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

CPC classification number: G01J1/4204 ,  G01J1/0295 ,  G01J1/0437

Abstract: A light sensor structure and the manufacturing method thereof are disclosed. The light sensor structure includes a substrate with a first surface and a second surface opposite to each other. A light sensing element including a light sensing area is disposed on the first surface. A reflection layer is disposed on the second surface. The reflection layer covers a portion of the second surface aligning with the light sensing area.

公开(公告)号：US09865765B2

公开(公告)日：2018-01-09

申请号：US14822906

申请日：2015-08-11

Applicant: SensorTek technology Corp.

Inventor： Feng-Jung Hsu ,  Chu-Yuan Yang ,  Yuan-Ching Hsu ,  Yi-Hua Chang

IPC: H01L31/12 ,  H01L31/18 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02 ,  G01S7/481

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.