COMMUNICATION APPARATUS AND CONTROL DEVICE TO GENERATE CONTROL DATA
    2.
    发明申请
    COMMUNICATION APPARATUS AND CONTROL DEVICE TO GENERATE CONTROL DATA 审中-公开
    用于生成控制数据的通信装置和控制装置

    公开(公告)号:US20100157034A1

    公开(公告)日:2010-06-24

    申请号:US12625297

    申请日:2009-11-24

    IPC分类号: H04N7/18 H04L12/66

    CPC分类号: H04N7/147 G06F3/011

    摘要: A communication apparatus may include a camera for obtaining an image and providing image data, and a control device for generating an input image descriptor from the image data, for determining whether the generated input image descriptor corresponds to a pre-stored reference image descriptor, and for generating control data for controlling the communication apparatus based on the determination.

    摘要翻译: 通信装置可以包括用于获得图像和提供图像数据的相机,以及用于从图像数据生成输入图像描述符的控制装置,用于确定所生成的输入图像描述符是否对应于预先存储的参考图像描述符,以及 用于基于该确定产生用于控制通信装置的控制数据。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130050896A1

    公开(公告)日:2013-02-28

    申请号:US13569738

    申请日:2012-08-08

    IPC分类号: H01G4/12

    摘要: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

    摘要翻译: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括:陶瓷主体,其包括电介质层; 第一和第二内部电极,其设置成在陶瓷主体内彼此面对; 以及第一外部电极和第二外部电极,其中所述第一和第二外部电极包括导电金属和玻璃,并且当所述第一外部电极和第二外部电极中的至少一个在厚度方向上被分成三个相等的部分时, 的中心部分的玻璃的总面积的35%至80%。 具有提高的可靠性的多层陶瓷电子部件可以通过提高芯片气密性来实现。

    CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF
    7.
    发明申请
    CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF 审中-公开
    用于终止电极的导电性组合物,包括其的多层陶瓷电容器及其制造方法

    公开(公告)号:US20120154977A1

    公开(公告)日:2012-06-21

    申请号:US13111319

    申请日:2011-05-19

    CPC分类号: H01G4/2325 H01B1/16 H01G4/30

    摘要: There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO2-bB2O3-cAl2O3-dTMxOy-eR12O-fR2O, where TM is a transition metal selected from a group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe) and nickel (Ni); R1 is selected from a group consisting of lithium (Li), sodium (Na) and potassium (K); R2 is selected from a group consisting of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba); each of x and y is larger than 0; and ‘a’ ranges from 15 to 70 mol %, ‘b’ ranges from 15 to 45 mol %, ‘c’ ranges from 1 to 10 mol %, ‘d’ ranges from 1 to 50 mol %, ‘e’ ranges from 2 to 30 mol % and ‘f’ ranges from 5 to 40 mol %. The conductive paste composition for a termination electrode includes a glass frit compound having improved corrosion resistance to a plating solution, thus effectively preventing the penetration of the plating solution and enhancing chip reliability.

    摘要翻译: 提供了一种终端电极用导电性糊剂组合物及其制造方法。 用于终端电极的导电糊组合物包括导电金属粉末和由下式表示的玻璃料:aSiO 2 -BB 2 O 3 -cAl 2 O 3-d TM x O y e e 12 O-f R 2 O,其中TM是选自锌(Zn ),钛(Ti),铜(Cu),钒(V),锰(Mn),铁(Fe)和镍(Ni) R1选自锂(Li),钠(Na)和钾(K)组成的组中; R2选自镁(Mg),钙(Ca),锶(Sr)和钡(Ba)组成的组中; x和y各自大于0; 'a'为15〜70摩尔%,'b'为15〜45摩尔%,'c'为1〜10摩尔%,'d'为1〜50摩尔%,'e' 2〜30摩尔%,'f'为5〜40摩尔%。 用于端接电极的导电糊剂组合物包括具有改善的对电镀溶液的耐腐蚀性的玻璃料化合物,从而有效地防止了电镀液的渗透并提高了芯片的可靠性。