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公开(公告)号:US20100012300A1
公开(公告)日:2010-01-21
申请号:US12442110
申请日:2007-07-20
申请人: Seok-Hwan Moon , Gunn Hwang
发明人: Seok-Hwan Moon , Gunn Hwang
CPC分类号: H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要: Provided is a heat uniforming device for an electronic apparatus, which improves the flow and circulation of operating fluid through evaporation and condensation using capillary attraction. The heat uniforming device for the electronic apparatus includes: an evaporation unit comprised of a planar first plate including a first multi-channel capillary region for evaporating an externally injected operating fluid due to heat transmitted from a heating source; and a condensation unit comprised of a planar second plate including a second multi-channel capillary region for condensing vapor supplied from the evaporation unit and a return region having a fluid path that communicates with all channels of the second multi-channel capillary region.
摘要翻译: 提供一种用于电子设备的热均匀装置,其通过使用毛细吸引的蒸发和冷凝来改善工作流体的流动和循环。 电子设备的热均匀装置包括:蒸发单元,包括平面第一板,其包括第一多通道毛细管区域,用于从由加热源传递的热量蒸发外部喷射的工作流体; 以及冷凝单元,其包括平面第二板,所述平面第二板包括用于冷凝从所述蒸发单元供应的蒸气的第二多通道毛细管区域和具有与所述第二多通道毛细管区域的所有通道连通的流体路径的返回区域。
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公开(公告)号:US06619384B2
公开(公告)日:2003-09-16
申请号:US10093977
申请日:2002-03-08
申请人: Seok-Hwan Moon , Ho Gyeong Yun , Gunn Hwang , Tae Goo Choy , Joong Moo Park
发明人: Seok-Hwan Moon , Ho Gyeong Yun , Gunn Hwang , Tae Goo Choy , Joong Moo Park
IPC分类号: F28D1500
CPC分类号: F28D15/046
摘要: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.
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公开(公告)号:US20100059212A1
公开(公告)日:2010-03-11
申请号:US12517344
申请日:2007-10-31
申请人: Seok-Hwan Moon , Gunn Hwang
发明人: Seok-Hwan Moon , Gunn Hwang
CPC分类号: F28D15/0233 , B23P2700/09 , F28D15/046 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要: Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.
摘要翻译: 提供了一种热控制装置和制造热控装置的方法。 制造热封装置的方法,所述热控制装置具有用作通过潜热传递吸收/消散热量的工作流体的路径的外壳和形成在外壳的内壁中的槽,并产生移动工作流体的毛细管力, 其中所述方法包括:提供第一和第二模板,每个模板包括具有与所述凹槽相对应的形状的突出部分; 通过在第一和第二模板上沉积金属来形成第一和第二沉积膜; 分别在第一和第二沉积膜上堆叠第一和第二金属板; 从第一和第二金属板烧掉第一和第二模板; 以及通过组合所述第一和第二金属板来形成所述封套。
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公开(公告)号:US08584743B2
公开(公告)日:2013-11-19
申请号:US12765120
申请日:2010-04-22
申请人: Seok-Hwan Moon , Seung Youl Kang , Kyoung Ik Cho , Moo Jung Chu
发明人: Seok-Hwan Moon , Seung Youl Kang , Kyoung Ik Cho , Moo Jung Chu
IPC分类号: F28F7/00
CPC分类号: F28D15/00 , H01L23/36 , H01L23/373 , H01L2924/0002 , H01L2924/00
摘要: Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
摘要翻译: 提供一种用于电子通信设备的固体型散热装置。 固体式散热装置包括水平传递热量的石墨薄板,通过石墨薄板的多个金属填料垂直传递热量,以及附着在石墨薄板的上表面和下表面上的多个金属薄板, 连接到金属填料。
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5.
公开(公告)号:US20130098428A1
公开(公告)日:2013-04-25
申请号:US13569507
申请日:2012-08-08
申请人: Ho-Gyeong YUN , Seok-Hwan Moon , Yong-Duck Chung
发明人: Ho-Gyeong YUN , Seok-Hwan Moon , Yong-Duck Chung
IPC分类号: H01L31/058
摘要: Provided is a sunlight complex module, which includes a photovoltaic conversion part that generates electrical energy from sunlight,a heat collector board attached to a bottom of the photovoltaic conversion part to collect heat from a portion of the sunlight, which has a wavelength to pass through the photovoltaic conversion part, a heat pipe attached to the heat collector board, and transferring thermal energy collected in the heat collector board, to an outside thereof,and a mold sealed to maintain a vacuum therein. The photovoltaic conversion part, the heat collector board, and the heat pipe are accommodated in the mold.
摘要翻译: 提供了一种太阳光复合模块,其包括从太阳光产生电能的光伏转换部分,附接到光伏转换部分的底部的集热板,用于从具有波长通过的一部分太阳光收集热量 光电转换部,附着于集热板的热管,将收集在集热板上的热能传递到其外部,密封的模具,以保持真空。 光电转换部分,集热板和热管容纳在模具中。
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