Loop type micro heat transport device
    1.
    发明授权
    Loop type micro heat transport device 有权
    环型微型热输送装置

    公开(公告)号:US07971633B2

    公开(公告)日:2011-07-05

    申请号:US11577233

    申请日:2005-12-09

    IPC分类号: H05K7/20

    摘要: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

    摘要翻译: 本发明提供一种环型微热输送装置,其特征在于,具有:下板,其具有用于在其上表面存储工作流体的储存器,与所述储存器间隔开的蒸发部,蒸发所述工作流体;以及冷凝部, 蒸发部分 以及与所述下板的上表面接合并形成在与所述蒸发部和所述冷凝部对应的位置的上板,并且包括具有蒸气管的蒸气空间,蒸发部蒸发的蒸汽通过所述蒸气管路被输送到所述蒸发部 冷凝部件,其中工作流体循环通过储存器,蒸发部件和冷凝部件。 因此,由于其简单的结构有助于使制造简单,并且提高冷却性能并且能够进行长距离的热输送,因此可以显着提高生产率。

    MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF 有权
    微型PIEZORESISTIVE压力传感器及其制造方法

    公开(公告)号:US20100251826A1

    公开(公告)日:2010-10-07

    申请号:US12745745

    申请日:2008-04-21

    IPC分类号: G01L9/06 H01L41/22

    摘要: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

    摘要翻译: 提供一种微型半导体型压力传感器及其制造方法。 微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现,通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层,形成膜 在形成空腔的氧化物层和衬底的上部上形成一层形成材料层,在膜形成材料层中形成多个蚀刻孔,通过多个蚀刻孔去除腔形成氧化物层,以形成埋入腔 在所述基板中,在所述膜形成材料层的上部形成膜增强层,以形成用于封闭所述空腔的膜,并且在所述膜的上部形成由压阻材料制成的敏感膜。

    Heat pipe having woven-wire wick and straight-wire wick

    公开(公告)号:US06619384B2

    公开(公告)日:2003-09-16

    申请号:US10093977

    申请日:2002-03-08

    IPC分类号: F28D1500

    CPC分类号: F28D15/046

    摘要: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.

    Micro piezoresistive pressure sensor and manufacturing method thereof
    4.
    发明授权
    Micro piezoresistive pressure sensor and manufacturing method thereof 有权
    微压阻式压力传感器及其制造方法

    公开(公告)号:US08261617B2

    公开(公告)日:2012-09-11

    申请号:US12745745

    申请日:2008-04-21

    IPC分类号: G01L9/06 B23P17/04

    摘要: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

    摘要翻译: 提供一种微型半导体型压力传感器及其制造方法。 微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现,通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层,形成膜 在形成空腔的氧化物层和衬底的上部上形成一层形成材料层,在膜形成材料层中形成多个蚀刻孔,通过多个蚀刻孔去除腔形成氧化物层,以形成埋入腔 在所述基板中,在所述膜形成材料层的上部形成膜增强层,以形成用于封闭所述空腔的膜,并且在所述膜的上部形成由压阻材料制成的敏感膜。

    FLAT PLATE TYPE MICRO HEAT SPREADING DEVICE
    5.
    发明申请
    FLAT PLATE TYPE MICRO HEAT SPREADING DEVICE 审中-公开
    平板式微热加热装置

    公开(公告)号:US20100258278A1

    公开(公告)日:2010-10-14

    申请号:US12744673

    申请日:2008-04-01

    IPC分类号: F28D15/04 F28D15/00

    摘要: A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.

    摘要翻译: 提供了平板式散热装置。 平板式散热装置可以通过利用热源的热量产生液体的相变来减少热量,从而解决由诸如个人计算机或移动电话的电子设备的部件中产生的热量所引起的各种问题。 具体地说,平板式散热装置包括用于蒸发液体的下板,与下板的上表面组合的中间板,其分别包括蒸发的蒸汽通过的路径和冷凝流体流入的路径 下板和与中间板的上表面组合的上板,其冷凝蒸发的蒸气。

    HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    热控制装置及其制造方法

    公开(公告)号:US20100059212A1

    公开(公告)日:2010-03-11

    申请号:US12517344

    申请日:2007-10-31

    IPC分类号: F28F13/00 B21D53/02

    摘要: Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

    摘要翻译: 提供了一种热控制装置和制造热控装置的方法。 制造热封装置的方法,所述热控制装置具有用作通过潜热传递吸收/消散热量的工作流体的路径的外壳和形成在外壳的内壁中的槽,并产生移动工作流体的毛细管力, 其中所述方法包括:提供第一和第二模板,每个模板包括具有与所述凹槽相对应的形状的突出部分; 通过在第一和第二模板上沉积金属来形成第一和第二沉积膜; 分别在第一和第二沉积膜上堆叠第一和第二金属板; 从第一和第二金属板烧掉第一和第二模板; 以及通过组合所述第一和第二金属板来形成所述封套。

    Flat plate type micro heat transport device
    8.
    发明授权
    Flat plate type micro heat transport device 有权
    平板式微型传热装置

    公开(公告)号:US08490683B2

    公开(公告)日:2013-07-23

    申请号:US12744669

    申请日:2008-04-21

    IPC分类号: F28D15/00 F28F7/00 H05K7/20

    摘要: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of the plates includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transporting heat generated by a heat source.

    摘要翻译: 提供了一种平板型微型热输送装置,它由彼此相互耦合的彼此相对的两个板形成,每个板包括:储存器,其形成为储存通过入口装入的移动流体; 蒸发器,其与所述储存器分离以通过汽化所述移动流体产生具有潜热的蒸汽; 形成为连接到蒸发器的蒸汽流动路径,通过该蒸汽流动具有潜热的蒸气被输送; 冷凝器,形成为连接到蒸汽流动路径并冷凝具有潜热的蒸汽; 以及液体流路,其形成为连接到冷凝器和蒸发器并且与蒸汽流动路径分离以输送通过冷凝蒸气获得的液体。 该设备可以通过有效地传输由热源产生的热量来有效地控制相对于便携式电子设备的热量。

    HEAT TRANSFER DEVICE WITH FUNCTIONS OF POWER GENERATION
    9.
    发明申请
    HEAT TRANSFER DEVICE WITH FUNCTIONS OF POWER GENERATION 审中-公开
    具有发电功能的传热装置

    公开(公告)号:US20110079372A1

    公开(公告)日:2011-04-07

    申请号:US12990146

    申请日:2008-12-11

    IPC分类号: F28D15/04

    摘要: Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside.

    摘要翻译: 本发明提供一种传热装置,除了具有将从加热元件传递到外部的热量的传热功能之外,还具有通过其上沉积有薄压电薄膜的毛细管槽的振动产生动力的功能。

    FLAT PLATE TYPE MICRO HEAT TRANSPORT DEVICE
    10.
    发明申请
    FLAT PLATE TYPE MICRO HEAT TRANSPORT DEVICE 有权
    平板式微型热交换装置

    公开(公告)号:US20100243214A1

    公开(公告)日:2010-09-30

    申请号:US12744669

    申请日:2008-04-21

    IPC分类号: F28D15/04

    摘要: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of which includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transportring heat generated by a heat source.

    摘要翻译: 提供了一种平板式微型热输送装置,它由彼此相互耦合的彼此相对的两个板形成,每个板彼此相对,包括:储存器,其形成为储存通过入口充电的移动流体; 蒸发器,其与所述储存器分离以通过汽化所述移动流体产生具有潜热的蒸汽; 形成为连接到蒸发器的蒸汽流动路径,通过该蒸汽流动具有潜热的蒸气被输送; 冷凝器,形成为连接到蒸汽流动路径并冷凝具有潜热的蒸汽; 以及液体流路,其形成为连接到冷凝器和蒸发器并且与蒸汽流动路径分离以输送通过冷凝蒸气获得的液体。 该装置可以通过有效地传输由热源产生的热来有效地控制相对于便携式电子设备的热量。